Kabushiki Kaisha Shinkawa

Shinkawa Ltd.

Mitsuaki Sakakura

Minoru Kawagishi

Tadashi Akiike

Toru Maeda

Nobuto Yamazaki

Koichi Harada

Minoru Torihata

Ryuichi Kyomasu

Shinichi Nishiura

Fumio Miyano

Yuji Tanaka

Nobuyuki Aoyagi

Takayuki Iiyama

Hikaru Miura

Yuhei Ito

Takuya Asami

Junkichi Enomoto

Syoji Ito

An ultrasonic horn () includes: a vibration source part () to which an ultrasonic vibrator () is mounted; a tip end part () to which a capillary () is mounted; and an intermediate part () which is interposed between the tip end part () and the vibration source part () and propagates vibration generated by the ultrasonic vibrator () to the tip end part (). The intermediate part () is formed with a single spiral hole () which is a hole penetrating in a radial direction of the ultrasonic horn () and advances in an axial direction as the spiral hole advances in a circumferential direction.

Ultrasonic horn and manufacturing apparatus of semiconductor device

An antioxidant gas blow-off unit includes: a base portion configured as a hollow plate having an antioxidant gas flow passage formed therein; a hole that is provided in the base portion to allow a capillary to be inserted therein or removed therefrom and that communicates with the antioxidant gas flow passage; and a heater mounted on an outer surface of the base portion. The antioxidant gas flow passage includes a first flow passage provided in the vicinity of the outer surface of the base portion on which the heater is mounted. This antioxidant gas blow-off unit to be installed in a wire bonding apparatus heats free air balls effectively with a compact structure.

Antioxidant gas blow-off unit

Provided is an antioxidant gas supply unit including: a base body () in a shape of a hollow plate having antioxidant gas flow paths () and () defined therein; an antioxidation gas inlet () for letting an antioxidant gas flow into the antioxidant gas flow paths () and (); a through hole () penetrating through the base body () in a through-thickness direction so that a capillary () is allowed to be inserted into and removed from the hole, and communicating with the antioxidant gas flow paths () and () to let the antioxidant gas flow out; and a film heater () attached to an outer surface of the base body () around the through hole (). The antioxidant gas supply unit has a compact structure and is capable of effectively heating a free air ball.

Antioxidant gas supply unit

An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power supply. When the direct-current high voltage power supply is turned ON, a space discharge occurs between the tip end of the wire and the torch electrode, resulting in that the wire tip end melts and is formed into a ball and that the tin of the torch electrode is also heated to a high temperature and diffused into space, so that ionized plus tin ions are attracted to the tip end of the melted wire, thus causing tin to adhere to the surface of the ball-shaped tip end of the wire, and forming an initial ball that has a low-melting-point coating material adhered to its surface.

Initial ball forming method for wire bonding wire and wire bonding apparatus

A wire bonding apparatus having a capillary with a wire passing therethrough; and when the switch of a first direct-current high-voltage power supply is switched ON, a space discharge takes place between the tip end of the wire and a torch electrode, and the tip end of the wire is melted by the discharge, making a ball-form ball base. When the switch of a second high-voltage power supply is switched ON, a space discharge takes place between a pair of dissociated gas forming electrodes made of a coating material whose melting point is lower than that of the wire, so that a dissociated gas containing tin ions is formed. The ball base is positioned inside the dissociated gas, and thus, tin adheres to the surface of the ball base, and an initial ball with a low-melting-point coating material adhering to the surface is formed.

An ultrasonic transducer used in a bonding apparatus, comprising a first hollow section, which communicates with a rear end opening formed in a base end of a horn body of the transducer, and an inner unit, which is installed inside the first hollow section. The inner unit comprises a vibrator assembly and a pressing block, and the pressing block pushes and fastens in place the vibrator assembly in the first hollow section. A through-hole is formed in the central portion of the inner unit, and a second hollow section and third hollow section are further formed in the horn body. Signal wires are connected to the vibrator assembly through the rear end opening.

Ultrasonic transducer for a bonding apparatus and method for manufacturing the same

An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.

Capillary holding structure for ultrasonic horn

An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions. In addition, a tightening member, such as a nut, is screwed on the external screw section so that a ring-form pressing part which is formed on the tightening member presses only against the vertically opposing end portions of the spacer, thus holding the capillary on the horn.

Capillary holding structure for an ultrasonic horn

An ultrasonic horn of a bonding apparatus quipped with a bonding tool attached to one end of the horn and a vibration-generating source such as an electrostrictive strain element, magnetostrictor, etc. attached to a bonding arm that supports the bonding horn. The ultrasonic horn is further provided with a vertical vibration adjuster which adjusts the vertical component of the vibration of the ultrasonic horn, and the vertical vibration adjuster includes a projection, recess, etc. provided at the end of the horn.

Bonding apparatus

A bonding apparatus used in manufacturing semiconductor devices, etc. including an ultrasonic horn mounted to a bonding arm of the bonding apparatus via a horn support. The ultrasonic horn is provided with a bonding tool at one end and a vibration-generating source at another end, and respective values of vibrational wavelengths on both sides of the horn support are set so that the value on the bonding tool side of the horn support is 7 or greater relative to a value of 3 on the opposite side of the horn support from the capillary. In other words, the distance from the horn support to the end of the vibration-generating source is set to be 1/4 of the wavelength, and the distance from the horn support to the end of the horn where the bonding tool is attached is set to be 3/4 of the wavelength.

A capillary-retaining structure for an ultrasonic horn used in a wire bonding apparatus including a stress relief hole formed inside of a capillary attachment hole that is opened at an end portion of the ultrasonic horn. Thus, the capillary retention by the ultrasonic horn is stabilized, and the vibrational characteristics of the ultrasonic horn are also stabilized, thus improving overall bondability in wire bonding. The same effect can be obtained by setting the thickness of a portion between the end surface of the horn and the capillary attachment hole to be thin or by utilizing a bold and nut combination to hold the capillary.

Capillary-retaining structure for an ultrasonic horn

A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire held by the clamping arms, the overall weight of the wire clamper can be small, a quick clamping action is secured and the clamping force which is easily adjustable can be steady at a set value.

Wire clamper

A wire bonding apparatus in fabricating, for example, semiconductor devices including a bonding arm that is vertically and horizontally movable and has a capillary through which a bonding wire is passed. The bonding arm is provided with a piezoelectric element which transmits a vibration to the capillary via its electric strain effect or magnetic strain effect so that the capillary performs wire bonding. With the use of the piezoelectric element that is provided near the capillary, vibrational energy loss can be minimal, and the frequency and amplitude of the vibration can be changed during each bonding operation.

Growing community of inventors

Tokyo, Japan

Mitsuaki Sakakura