Kabushiki Kaisha Toshiba

Toshiba Materials Co., Ltd.

Toshiba Medical Systems Corporation

Toshiba Lighting & Technology Corporation

Seoul Semiconductor Co., Ltd.

Mitsuaki Kato

Hiroshi Ohno

Katsumi Hisano

Tomonao Takamatsu

Kenji Hirohata

Masataka Shiratsuchi

Yuichiro Yamamoto

Akihiro Goryu

Tomoyuki Suzuki

Akira Kano

Hiroyasu Kondo

Hiromichi Hayashihara

Ryoji Tsuda

Takashi Usui

Yasuko Fujisawa

Satoshi Wakai

Shigeo Kaminaga

Tetsuya Kugimiya

Takeshi Morino

Yasuhiro Shirakawa

Hideo Tamura

Kazumasa Arakita

Yoshinori Honguh

Junya Tanaka

Masahiko Yamamoto

Hideaki Okano

Junichiro Ooga

Yasumasa Ooya

Takayoshi Moriyama

Takahiro Omori

Yoshihiro Ikeda

Masatoshi Hirono

Hiroya Kano

Masato Akita

Shinya Higashi

Takuya Hongo

Kazuyo Narita

Makoto Yamazaki

Yumi Hanyuda

Yoshinori Mori

Junya Murata

Tomoya Fumikura

A semiconductor deviceincludes a pair of electrodesand a conductive connection memberelectrically bonded to the pair of electrodes. At least a portion of a perimeter of a bonding surfaceof at least one of the pair of electrodesand the conductive connection memberincludes an electromigration reducing area

Semiconductor device and inspection device

According to one embodiment, a fluid controller includes a fluid channel deforming portion and a mixing portion provided downstream from the fluid channel deforming portion. The fluid channel deforming portion includes an upstream end portion, a first channel, a second channel and a channel terminating portion. At least one of the first and second channels is deformed between the upstream end portion and the channel terminating portion. A region of the second channel in a second cross-section, is increased more than a region of the second channel in the first cross-section, between the upstream end portion ad the channel terminating portion. The mixing portion mixes a plurality of fluids flowing through the fluid channel deforming portion.

Fluid controller and fluid mixer

A semiconductor device inspection apparatus according to embodiments comprises: an action unit that generates an internal stress in a predetermined direction in a semiconductor device; a stress controller that controls a magnitude of the internal stress generated in the semiconductor device by the action unit; a probe electrically connected to the semiconductor device; a probe controller that supplies a current to the semiconductor device via the probe; and a controller that screens the semiconductor device based on a first current flowing through the semiconductor device via the probe while the internal stress is not generated in the semiconductor device and a second current flowing through the semiconductor device via the probe while the action unit generates the internal stress in the semiconductor device.

Semiconductor device inspection apparatus, semiconductor device inspection method, program thereof, semiconductor apparatus, and manufacturing method therefor

An inspection device comprises: a detecting unit that is connected to a plurality of semiconductor chips having mutually different rates of change of electrical resistance with respect to stress loading direction, and that detects an electrical resistance value of each semiconductor chip from electric current flowing in each semiconductor chip; a first memory unit that is used to hold model data meant for converting an electrical resistance value into a characteristic value indicating at least either temperature, or stress, or strain; a converting unit that converts the electrical resistance value of each semiconductor chip as detected by the detecting unit into the characteristic value using the model data held in the first memory unit; and a second memory unit that is used to store the characteristic value, which is obtained by conversion by the converting unit, as time-series data for each of the plurality of semiconductor chips.

Inspection device, inspection system, intelligent power module, inspection method, and computer program product

A semiconductor device comprises a semiconductor chip and a mounting substrate. The semiconductor chip has an element structure including: a silicon carbide substrate that has a hexagonal crystal structure; a gate electrode that is disposed on a part above a first surface corresponding to a (0001) plane or a (000-1) plane of the silicon carbide substrate; an insulating film that is interposed between the silicon carbide substrate and the gate electrode; and a source and a drain that are disposed with respect to the silicon carbide substrate and the gate electrode such that at least a part of a channel through which a carrier moves extends in a &#x3c;1-100&#x3e; direction of crystal orientation of the silicon carbide substrate. The mounting substrate is fixed with the semiconductor chip such that compressive stress in a &#x3c;11-20&#x3e; direction of crystal orientation of the silicon carbide substrate is applied to the semiconductor chip at least in operation.

Semiconductor device and method of manufacturing the same

According to one embodiment, a lighting device includes a hollow globe having an opening at an end thereof, a light source housed in the globe and including at least an LED, a pillar portion housed in the globe and supporting the light source, a cap connector directly connected to the pillar portion, or indirectly connected to the pillar portion via another member, and a cap attached to the cap connector and electrically connected to the light source. A thermally conductive layer is provided between the inner surface of the globe and the lateral surface of the pillar portion.

Lighting device

According to one embodiment, a lighting device includes a hollow main body having thermal conductivity, a light source having at least a semiconductor light-emitting element, an accessory element, and an adiabatic member. The light source is thermally coupled to the main body. The accessory element has an allowable temperature limit different from that of the light source, and is accommodated in the main body. The adiabatic member divides the main body into a first region thermally coupled to the light source, and at least a second region thermally coupled to the accessory element and thermally isolated from the first region.

An image processing apparatus according to an embodiment includes a processing circuitry. The processing circuitry is configured to obtain images in a time series including images of a blood vessel of a subject and correlation information indicating a correlational relationship between physical indices of the blood vessel and function indices of the blood vessel related to vascular hemodynamics, calculate blood vessel morphology indices in a time series indicating morphology of the blood vessel of the subject, on a basis of the images in the time series, and identify a function index of the blood vessel of the subject, by using a physical index of the blood vessel of the subject obtained from the blood vessel morphology indices, on a basis of the correlation information.

Image processing apparatus, image processing method, and storage medium

In one embodiment, an illumination device includes a light-guiding unit having a light output surface which outputs light and a back surface facing the light output surface, wherein the light-guiding unit has a curved surface in a region of the back surface farther than a first position on the back surface that is away by a first distance from an axis passing the light output surface and the back surface, and a rough surface in a region of the light output surface farther than a second position on the light output surface that is away by a second distance from the axis in a same direction as a direction from the axis toward the first position, and where an intersection of the axis and the back surface is an origin point, and a direction of the axis from the back surface to the light output surface is positive, a normal line of the curved surface intersects with the axis at the positive side of the axis, and an angle formed by a normal line vector at the second position in a direction toward the light output surface from the back surface of the light output surface and a vector in a direction from the curved surface to the second position is equal to or more than a critical angle.

Illumination device and light-guiding member

An image processing apparatus according to an embodiment includes storage circuitry and processing circuitry. The storage circuitry stores therein fluid resistance data representing a correlation among a vascular shape, a blood flow rate, and a pressure loss. The processing circuitry extracts, from three-dimensional image data in which a blood vessel of a subject is rendered, vascular shape data representing a shape of the blood vessel. The processing circuitry performs fluid analysis based on the vascular shape data and the blood flow rate and the pressure loss that correspond to the vascular shape data and that are correlated by the fluid resistance data to derive a functional index related to a blood circulation state in the blood vessel of the subject.

A lighting apparatus according to an embodiment includes a globe, an optical element including a scattering portion inside and transparent to visible light, and a light source disposed to be opposed to a light incident surface of the optical element. The scattering portion is disposed inside the globe.

Lighting apparatus

According to one embodiment, an electronic device capable of switching power on and power off by a switch outside the electronic device, the electronic device includes a determination unit, a detection unit, an output unit, and a control unit. The determination unit determines whether power is supplied from an AC power source or not. The detection unit detects a conductive state of the switch. The control unit performs at least one of cutting off power to be supplied to the output unit, supplying power from the AC power source to the output unit, and supplying power from a second power source different from the AC power source to the output unit.

Electronic device

A light guiding body includes, an introducing portion including a plane of incidence and a plane of reflection opposite to the plane of incidence, a diffusion portion including a first plane provided on a side of the plane of reflection and a second plane provided on the side of the plane of incidence and opposite to the first plane, a first point positioned on a border between the plane of reflection and the first plane, and a second point on the plane of incidence, wherein when a center of curvature of the first plane at the first point is a third point, an index of refraction of the light guiding body is n, the curvature of the first plane at the first point is K, and a distance between the second point and the third point is D, Formula (4) is satisfied.

Light guiding body and lighting system

According to one embodiment, a lighting apparatus includes a light source which includes a light emitting surface, and a light guide provided to be coaxial with an axis which extends along a direction perpendicular to the light emitting surface. The light guide includes: an incident plane facing the light emitting surface; an outer circumferential surface configured to protrude in a direction extending away from the light source so as to surround the axis from an outer periphery of the incident surface and so as to totally reflect light from the light source which is made to enter the light guide from the incident surface; and a hollow part provided at a position distant in the axis direction from the incident surface. The hollow part includes a first light diffusing surface parallel to an axis along which the light totally reflected on the outer circumferential surface is led.

Lighting apparatus and light guide

According to an embodiment, a three-dimensional modeling head includes a heat insulating member, a light emitter, a cylindrical member, and a light absorbing member. The heat insulating member has a sealed space therein with a curved wall surface that reflects light. The light emitter emits light and has at least a light emitting face provided in the sealed space. The cylindrical member is placed to extend through the heat insulating member via the sealed space and is long in a first direction in which thermoplastic resin is ejected. The light absorbing member adsorbs light and is provided in contact with at least part of the cylindrical member in the sealed space and in an area of the sealed space containing a focusing position on which at least part of light emitted by the light emitter and reflected by the wall surface is focused.

Three-dimensional modeling head and three-dimensional modeling device

Growing community of inventors

Kawasaki, Japan

Mitsuaki Kato