Shin-etsu Chemical Co., Ltd.

Mitsuaki Igarashi

Hironao Fujiki

Mikio Shiono

Morio Oohasi

There is provided an organopolysiloxane composition for electrical insulation wherein the fluidity is good and an inorganic filler deposited on the bottom of a vessel during the storage can be easily and simply redispersed. The unfoamable organopolysiloxane composition for electrical insulation comprises (A) an organopolysiloxane containing at least two alkenyl groups each bonded to a silicon atom in the molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms each bonded to a silicon atom in the molecule, (C) an organopolysiloxane containing at least one hydroxyl group bonded to a silicon atom in the molecule, (D) an inorganic filler having an average particle diameter of 1 to 50 .mu.m, and (E) platinum or a platinum compound.

Organopolysiloxane composition for electrical insulation

A mold-releasable curable organopolysiloxane composition suitable for use as a material of a matrix mold having excellent durability of mold releasability in the preparation of replicas by resin casting is disclosed. The composition comprises, in addition to the conventional ingredients including a vinyl-containing diorganopolysiloxane, an organohydrogenpolysiloxane as a crosslinking agent of the diorganopolysiloxane, a reinforcing silica filler and a platinum compound as a catalyst, a strongly alkaline compound of an alkali metal such as potassium hydroxide, potassium siliconate, lithium siliconate and the like in a limited amount.

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Gunma, Japan

Mitsuaki Igarashi