Hitachi, Ltd.

Mitsuaki Haneda

Ryoji Okada

Toshihiro Yamada

Susumu Hioki

Asao Nishimura

Akihiro Yaguchi

Kunio Takada

Takeshi Araya

Kenji Otani

Masayuki Yamada

Ichiro Anjoh

Masahiro Ichitani

Junichi Arita

Akihiko Iwaya

Kooji Aizawa

Makoto Kitano

Yoshishige Endo

Ryuji Kohno

Masami Masuda

Masatoshi Kanamaru

Nobuo Abe

Nae Yoneda

Yoshiro Ibaraki

Kazuyoshi Hatano

Keiji Taguchi

Toshio Yamanaka

Shigeya Kawaminami

Seiji Katayama

Kazuo Ikeda

Atushi Shimada

Kooichi Inaba

Akira Matsunawa

Hidenari Takada

Kunio Fukami

Tatuya Wakana

Maya Obata

Masanori Wakaizumi

Nobutoshi Hoshino

Tatuo Horie

Shoji Imanaga

Kooju Aizawa

Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit. The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC-12% sintered article is attained.

Bearing unit, drainage pump and hydraulic turbine each incorporating the

A method of producing a leadframe for use in semiconductor devices, comprises the steps of forming a space between leads 1a and 1b which are to be overlapped and welded each other, and welding the leads at a region including the space and melting and cutting off one of the leads. In one of the leads which is melted, cohesion and separation of molten metal occur in the region around the space. As a result, unnecessary portions such as an outer frame used for positioning can be cut off at the same time when the leads are connected by welding. Thus, high precision positioning of a plurality of element leadframes as well as high assembling productivity are achieved.

Semiconductor leadframe and its production method and plastic

Drainage pump and a hydraulic turbine incorporating a bearing member,

Disclosed is a bearing unit which can be used in a drainage pump operated without supply of clean water or a hydraulic pump, which exhibits excellent wear resistance against water containing earth and sand and satisfactory assembling facility, and a method of manufacturing the bearing unit. The contact surface of a bearing made of stainless steel and/or that of a sleeve is applied with a sprayed coating, the main component of which is WC, and which contains one or more elements selected from a group consisting of nickel, chromium and cobalt as a binder material thereof, or a sprayed coating, the main component of which is Cr.sub.3 C.sub.2, and which contains NiCr as a binder material, after the sprayed coating has been formed, heating at from 300.degree. C. to 550.degree. C. is performed for one hour or longer so that hardness and wear resistance equivalent to those of a WC - 12% sintered article is attained.

A closed type motor-driven compressor includes a motor accommodated in a closed container and a compression mechanism connected through a crank shaft to the motor. A shielding member having a cylindrical portion substantially concentric with the axis of the compression mechanism is disposed between the motor and the compression mechanism. This shielding member defines a shielding air space between the motor and the compression mechanism for preventing a permeation of a lubricating oil. An inlet of a discharge pipe of the closed type motor-driven compressor is positioned inwardly of this shielding air space.

Closed type motor-driven compressor, a scroll compressor and a scroll

A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

Plastic-molded-type semiconductor device and producing method therefor

The process for forming an ultrafine-particle film according to this invention is characterized by irradiating the surface of a target of a raw material with laser energy in a predetermined atmosphere under conditions where a plume is generated, exposing a substrate (a base material) directly to the plume generated, and thereby forming a film. The substrate is positioned in the plume at a distance, from the surface of the target of the raw material, of at least the mean free path of atoms and/or molecules of the raw material (or components thereof). By so positioning the substrate, ultrafine particles of the raw material are deposited on the substrate. The plume containing a large amount of ultrafine particles moves at a high speed; and exposure of the substrate, at the specified position relative to the target, to the plume causes strong adhesion of ultrafine particles contained in the plume to the substrate, resulting in formation of a film.

Laser deposition process for forming an ultrafine-particle film

A sintering method and fusion welding method of the present invention are characterized in that energy is radiated to the black component of starting materials so as to convert it from the state of an energy absorber to the state of an energy reflector (the state where metallic luster is exhibited). The methods can be utilized effectively for forming the electrode of a sensor or the bump of an electronic component. When applied to the production of the sensor and the electrode, the methods can produce these products by a simple production process and with extremely high producibility.

Sintering method

In a method wherein arcs are struck across a material to vaporize into ultra-fine particles and an electrode, thereby to manufacture the ultra-fine particles; the material to turn into the ultra-fine particles is arranged for at least either of the electrodes, and plasma currents are generated from the material and the electrode, whereby the formation rate of the ultra-fine particles per unit input is increased, and the material is formed in the shape of a rod or a wire, and a feeder capable of continuously supplying the material is disposed, whereby the ultra-fine particles can be continuously manufactured.

Method for manufacturing ultra-fine particles

Aluminum or its alloy is subjected to surface treatment wherein the surface is heated and melted by the heat of an electric arc in an atmosphere of a mixture of inert gas and nitrogen gas. By this treatment, a dense layer of aluminum nitride is formed on the surface of aluminum or its alloy so that material of increased wear resistance is obtained.

Method for melt nitriding of aluminum or its alloy

Growing community of inventors

Ibaraki, Japan

Mitsuaki Haneda