Nitto-Denko Corporation

Mitsuaki Fusumada

Hiroshi Noro

Takashi Oda

Eiji Toyoda

Tomoaki Ichikawa

Yuki Sugo

Naoya Sugimoto

Nao Kamakura

Tsuyoshi Ishizaka

Tomohito Iwashige

A sheet for thermal bonding which has a tensile modulus of 10 to 3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt % and which, when heated from 23&#xb0; C. to 400&#xb0; C. in the air at a heating rate of 10&#xb0; C./min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt % or less.

Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape

The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a phenol resin; (C) an inorganic filler, and (D) a silicone compound containing an alkoxy group directly bonded to silicon atom in an amount of 10 to 45 wt % based on the entire silicone compound and having a specific gravity of 1.10 to 1.30.

Epoxy resin composition for semiconductor encapsulation

Provided is a method of producing a semiconductor device having a structure wherein a semiconductor chipis mounted on a wiring circuit substrateand sealed with a resin. A wiring circuit substratehaving a connecting conductor portion that can be connected to an electrode of the chip is formed on a metal support layerin a way such that the substrate can be separated from the metal support layer, the chipis mounted on the wiring circuit substratea sheet-shaped resin composition T is placed on the chip and heated on the chip to seal the chip, and the metal support layer is separated and divided to obtain individual semiconductor devices.

Manufacturing method for semiconductor device

A thermosetting resin composition which contains:

Thermosetting resin composition and semiconductor device obtained with the same

A thermosetting resin composition usable for sealing a gap formed between a printed circuit board and a semiconductor element in a semiconductor package having a face-down structure; a semiconductor device comprising a printed circuit board, a semiconductor element, and the thermosetting resin composition mentioned above, wherein a gap formed between the printed circuit board and the semiconductor element is sealed by the thermosetting resin composition; and a process for manufacturing the semiconductor device.

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Ibaraki, Japan

Mitsuaki Fusumada