Panasonic Corporation

Mitio Ohba

Nobuya Matsutani

Yuichi Takahashi

Koji Shimoyama

Shinichi Morimoto

The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions () in one main surface of substrate () and insulating resin layer () having a spiral void portion () disposed in the region thereof, a step of forming metal layer () in frame-like void portion () and spiral void portion () and on insulating resin layer (), a step of polishing metal layer () at least up to the upper surface of insulating resin layer and forming coil section () in spiral void portion (), and a step of forming a metal layer for connecting chip parts to frame-like void portion (), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.

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Osaka, Japan

Mitio Ohba