Intel Corporation

Other

Mitesh C Patel

Saikumar Jayaraman

James Chris Matayabas, Jr

Daewoong Suh

Ashay A Dani

Anna M Prakash

Vijay Wakharkar

Gregory S Clemons

Gudbjorg H Oskarsdottir

Edward L Martin

Tiffany Byrne

Shalabh Tandon

Wei Keat Loh

Sheau Hooi Lim

Stephen E Lehman

Yoong Tatt P Chin

Mohd Erwan B Basiron

The system for vacuum formation of a dental appliance is a fully automated vacuum formation machine for dental appliances, such as retainers and the like. The system includes a base having a perforated top vacuum plate in communication with a vacuum source. A heating unit is positioned above the perforated top vacuum plate, and a controller is in communication with the heating unit and the vacuum source for selective actuation thereof. A holder releasably receives a thermoplastic plate. The holder is selectively positionable vertically over the perforated top vacuum plate and a dental impression cast mounted thereon. The holder is positioned by a linear actuator or the like, in communication with the controller. A sensor is positioned adjacent the perforated top vacuum plate for measuring the thermoplastic plate's thickness as it is molded about the dental impression cast, and is communication with the controller.

System for vacuum formation of dental appliance

A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.

Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same

The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Process for precise alignment of packaging caps on a substrate

A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.

Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted material

A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Apparatus for precise alignment of packaging caps on a substrate

Numerous embodiments of an apparatus and method to stress and warpage of semiconductor packages are described. In one embodiment, a semiconductor die is disposed above a substrate. An encapsulating material is disposed above the substrate and semiconductor die, in which the encapsulating material has a combination of a low coefficient of thermal expansion material and a high coefficient of thermal expansion material.

Package stress management

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Chandler, AZ, United States of America

Mitesh C Patel