3m Innovative Properties Company

Other

Mitchell T Huang

Mario Alberto Perez

Michael A Kropp

David V Mahoney

Robert H Turpin

Jeremy M Higgins

Martin H Fox

Clint J Novotny

David S Stankes

Kerstin C Rosen

Claus H G Middendorf

Christoph Kuesters

William B Stockton

Amy Douglass

Donald A Gagnon

Rhesa M Browning

Jan Thomas Krapp

A multilayer material for use as a thermal insulation barrier and/or flame barrier in a rechargeable electrical energy storage system is provided. The multilayer material comprises at least one inorganic fabric layer bonded to a nonwoven layer comprising inorganic particles and inorganic fibers by an inorganic adhesive, wherein the inorganic adhesive. The inorganic adhesive can be a modified inorganic adhesive comprising at least 99 wt. % inorganic constituents and an organic additive of at least 0.01 wt. % and less than 1 wt. % based on a total solids content of the inorganic adhesive.

Thermal barrier material for a rechargeable electrical energy storage system

An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.

Oriented thermally conductive dielectric film

Provided is an article containing non-cellulosic nonwoven fabric layer between two non-cellulosic nonwoven paper layers wherein one or both of the nonwoven paper and nonwoven fabric are electrically insulating. At least some embodiments are flame retardant.

Electrical insulation material

Provided in at least one embodiment is a nonwoven paper layer directly fused on one or both sides with a nonwoven fabric layer wherein one or both of the nonwoven paper and nonwoven fabric are electrically insulating.

Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Photocurable form-in-place gasket for electronic applications

A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of about 7% to about 20%, a level of outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g and a Shore A hardness from about 45 to about 65.

Form-in-place gasket for electronic applications

Growing community of inventors

Austin, TX, United States of America

Mitchell T Huang