Eastman-kodak Company

Global Oled Technology LLC

Kodak Polychrome Graphics, Gmbh

Industrial Technology Research Institute

Eastman Kodak

Mitchell Stewart Burberry

Lee William Tutt

Ronald S Cok

Charles D DeBoer

Sharon W Weber

Steven Evans

Mary Christine Brick

Donald R Diehl

Margaret Jones Helber

Paula J Alessi

David B Bailey

Charles M Rankin

John M Noonan

Kam Chuen Ng

Dennis R Perchak

Charles Chester Anderson

Ching W Tang

Christine Joanne Landry-Coltrain

Mark Lelental

Kurt Michael Sanger

Andrew Daniel Arnold

Mark A Harris

Lawrence A Rowley

Myron W Culver

Debasis Majumdar

Douglas Robert Robello

Bruce C Campbell

Donald R Preuss

David M Johnson

Linda Mae Franklin

Scott E Tunney

Robert G Spahn

William K Goebel

Vito A DePalma

Danny R Thompson

Thomas A Machell

Yongcai Wang

David Howard Levy

Carolyn Rae Ellinger

Shelby Forrester Nelson

Michael L Boroson

Daniel Jude Harrison

Roger Guy Markham

Linda A Kaszczuk

Samir Y Farid

David B Kay

Kelvin Nguyen

Glenn T Pearce

Michael R Detty

Ian R Gould

Andrea S Rivers

Charles Warren Lander

Theodore K Ricks

Daniel D Haas

Bradley A Phillips

Giana M Phelan

James E Klijanowicz

Megan L Weiner

Elizabeth V Patton

Jason E Anderson

Mark S Kaplan

Gary M Underwood

Richard T Spring

A method of making a micro-channel electrode structure includes providing a curable layer and imprinting the curable layer to form an electrode micro-channel and a fluid micro-channel in a common step. The electrode micro-channel intersects the fluid micro-channel to form a micro-channel intersection. The curable layer is cured to form an imprinted cured layer. Both the electrode and the fluid micro-channels are filled with a developable material that is exposed with an electrode pattern including the electrode micro-channel and extending from the electrode micro-channel into the micro-channel intersection without occluding the fluid micro-channel. The exposed developable material is developed to remove the developable material from the electrode pattern and the electrode micro-channel and the micro-channel intersection corresponding to the electrode pattern are at least partly filled with a conductive material. At least a portion of the remaining developable material is removed from the fluid micro-channel.

Making micro-channel electrode structure

A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure that includes a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer including dispersed multiple biocidal particles on or over the support and a second cured layer on or over the first cured layer on a side of the first cured layer opposite the support. The multiple biocidal particles are dispersed within only the first curable layer. The structured bi-layer has at least one depth greater than the thickness of the second layer. The multi-layer biocidal structure is located on a surface.

Using imprinted multi-layer biocidal particle structure

A multi-layer biocidal structure includes a support. A structured bi-layer is located on or over the support. The bi-layer includes a first cured layer on or over the support and a second layer on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the first cured layer.

Imprinted multi-layer biocidal particle structure

A multi-layer biocidal structure includes a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer. Multiple biocidal particles are located only in the second layer.

Imprinted particle structure

A method of using a multi-layer biocidal structure includes providing a multi-layer biocidal structure having a support and a structured bi-layer on or over the support. The structured bi-layer includes a first cured layer on or over the support and a second layer in a spatial relationship to the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least one depth greater than the thickness of the second layer and multiple biocidal particles located only in the second layer. The multi-layer biocidal structure is located on a surface.

Using imprinted particle structure

A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support. A second layer is located on or over the first curable layer, the second layer having multiple biocidal particles located within the second layer. The first curable layer and the second layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second layer. The first curable layer is cured to form a first cured layer with a second layer. The imprinting stamp is removed.

Making imprinted particle structure

A method of making a multi-layer biocidal structure includes providing a support and locating a first curable layer on the support, the first curable layer including dispersed multiple biocidal particles. A second curable layer is located on the first curable layer; the multiple biocidal particles are dispersed within only the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed.

Making imprinted multi-layer biocidal particle structure

A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

Imprinted micro-wire rib structure

A touch-screen device is disclosed having a touch-sensitive area that includes a plurality of patterned driver electrodes, each having a plurality of patterned conductive electrically connected driver micro-wires. An unpatterned conductive layer that is unpatterned in the touch-sensitive area is in electrical contact with the driver micro-wires of the driver electrodes. A plurality of patterned sensor electrodes each includes a plurality of patterned conductive electrically connected sensor micro-wires. A dielectric layer is located between the driver electrodes and the sensor electrodes.

Micro-wire touch screen with unpatterned conductive layer

A method of making an electrical conductor includes depositing an ultra-thin layer including aluminum-doped zinc oxide layer on a surface and using atomic layer deposition to deposit a nano-layer including alumina in contact and conformal with a surface of the ultra-thin layer including aluminum-doped zinc oxide.

Method of passivating ultra-thin AZO with nano-layer alumina

A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.

Transparent capacitor with multi-layer grid structure

An electrical conductor includes an ultra-thin layer of aluminum-doped zinc-oxide and a nano-layer of alumina in contact and conformal with a surface of the ultra-thin aluminum-doped zinc-oxide layer.

Ultra-thin AZO with nano-layer alumina passivation

Display apparatus with reduced susceptibility to electro-magnetic interference includes a display including an array of pixels and a ground mesh located in proximity to the display. The ground mesh includes a plurality of electrically connected ground lines located between the pixels, so that electro-magnetic radiation emitted or received by the display is reduced.

Display apparatus with pixel-aligned ground mesh

A method of making a micro-wire rib structure includes providing a substrate and locating a curable layer on or over the substrate. The curable layer is imprinted and cured to form a cured layer including a cured-layer surface and a micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A curable conductive material is located in the micro-channel and cured to provide a cured electrical conductor forming a micro-wire in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s), to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side.

Making imprinted micro-wire rib structure

A thin film transistor includes a post on a substrate. The post has a height dimension extending away from the substrate to a top portion of the post which extends a distance beyond a bottom portion of the post in a direction parallel to the substrate to define a reentrant profile. A conformal conductive gate layer is located on an edge of the post in the reentrant profile and not over the top portion of the post, and includes a portion that extends along the substrate. A conformal insulating layer is on the gate layer in the reentrant profile. A conformal semiconductor layer is on the insulating layer in the reentrant profile. First and second electrodes are located in contact with first and second portions of the semiconductor layer over the top portion of the post and not over the top portion of the post, respectively.

VTFT with gate aligned to vertical structure

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Webster, NY, United States of America

Mitchell Stewart Burberry