International Business Machines Corporation

Minnesota Mining and Manufacturing Company

Lexmark International, Inc.

Jds Uniphase Corporation

Aegis Lightwave, Inc.

Mitchell S Cohen

Jeannine Madelyn Trewhella

Glen Walden Johnson

Krishna Gandhi Sachdev

William K Hogan

Keith S Pennington

David Peter Gaio

Modest M Oprysko

Ali Afzali-Ardakani

James L Speidell

Sudipta Kumar Ray

Daniel Michael Kuchta

Michael Frank Cina

Stephen Louis Spanoudis

Steven Alan Cordes

Nicholas A Lee

Sylvain E Ouimet

Dennis L Rogers

Marco Gauvin

Andre Lacerte

Stephane Tremblay

Kie Y Ahn

Marie Angelopoulos

Paul Francis Fortier

Benson Chan

Phillip Duane Isaacs

Subhash Laxman Shinde

How Tzu Lin

Mario John Interrante

Lester W Herron

Richard Ronald Hall

Steven Paul Ostrander

Ari Aviram

Mark B Ritter

Gordon D Henson

S Jay Chey

Thomas Edward Lombardi

Mark H Kryder

John Henry Sherman

Ismail C Noyan

Ephraim Bemis Flint

Kurt R Grebe

Michael James Cordes

Mark F Bregman

Miles Frank Swain

Dianne L Lacey

Ladd William Freitag

John C Shen

Andrew T Pomerene

John V Powers

Kenneth Paul Jackson

Douglas J Hall

William D Brewer

Emerson W Pugh

Stephen Anthony Shear

Lung-jo Tao

Eugene Yi-Shan Ma

Patrick E McKnite

George A Sefler

Barbara A De Baun

Jeanine M Trewhella

Gregory W Beall

William D Weber

Joseph P Zinter

An optical device including: a glass substrate; a crystalline silicon layer bonded to the glass substrate; and a thermally tunable thin-film optical filter fabricated on top of the crystalline silicon layer.

Tunable optical filter with heater on a CTE-matched transparent substrate

Methods and arrangements for providing compact optical paths between an optical connector, such as an MTRJ connector, and optoelectronic chips contained in TO cans. The methods and arrangements employed for creating the optical paths include the use of fibers that are not prone to fail from bending stresses, or waveguides.

Optical fiber space transformation

An optical signal transceiver subassembly is mounted on a lead frame for further attachment to an electronic printed circuit board. The optical subassembly is comprised of a solid-state laser, a pair of photo-detectors, an over-mold of transparent material having shapes forming the exposed surface thereof, the surface and a selective silvering of a portion thereof defining a beam-splitter mirror and an interior reflective focusing surface, preferably in the shape of a partial cylindrical surface. The beam-splitter mirror is lightly silvered and the cylindrical surface is silvered to enhance the reflection of the laser beam. The optical subassembly is further enclosed with a housing incorporating a pair of lenses and alignment pins. The lenses focus the data stream of optical light signals onto the end of the outgoing optical fiber and the data stream of optical light signals from the incoming optical fiber onto and through the beam-splitter and onto a first photo-detector. The beam-splitter and the partial cylindrical surface reflect the laser beam portion deflected from the primary laser beam path onto a second photo-detector to provide a data stream from which the operation of the laser may be monitored, thereby insuring the proper transmission of the data signals provided to the laser through the lead frame and its associated electronic connections.

Optical subassembly for optical communications

A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.

Guides lithographically fabricated on semiconductor devices

A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.

Method of preventing solder wetting in an optical device using diffusion of Cr

A package is described that couples a twelve channel wide fiber optic cable to a twelve channel Vertical Cavity Surface Emitting Laser (VCSEL) transmitter and a multiple channel Perpendicularly Aligned Integrated Die (PAID) receiver. The package allows for reduction in the height of the assembly package by vertically orienting certain dies parallel to the fiber optic cable and horizontally orienting certain other dies. The assembly allows the vertically oriented optoelectronic dies to be perpendicularly attached to the horizontally oriented laminate via a flexible circuit.

Fiber optic connections and method for using same

A planar spectrograph for demultiplexing optical wavelength signals includes a monolithic substrate. The substrate has a diffraction grating etched therein. The diffraction grating is integrally formed in the substrate to be in operative relationship with input light to diffract and reflect the input light to a detector. A recess is formed in the substrate to accommodate a separate slab waveguide. A slab waveguide is dimensioned and configured to fit within the recess, and the waveguide guides input light to and from the diffraction grating. A silicon-on-insulator spectrographs is also described, as well as, fabrication processes for manufacturing these spectrographs.

Multimode planar spectrographs for wavelength demultiplexing and methods of fabrication

A fiber optic arrangement includes a chip, and a first light emitter and a second light emitter formed on the chip. A guide is formed on the chip and in registration with an active region of the second light emitter. An optical fiber is coupled to the second light emitter for transmitting light from the second light emitter. The guide aligns the optical fiber relative to the active region of the second light emitter. A light-sensing device is provided. An optical element transmits light emitted from the first light emitter to the light-sensing device for controlling an output optical power of at least the second light emitter.

Light emitter control system

An opto-electronic module is housed in a hermetically sealed housing which is fabricated on a base member of solderable material to which a side wall structure is soldered. A cover is similarly provided that either is soldered to the top open end of the housing at the edge of the housing wall structure or is a cup-shaped member that slides over the wall structure and is soldered at the juxtaposed faces of the walls of the cover and the wall structure. Overlapping slots co-align to form a passage through which optical fibers may pass through the walls. The hermetic seal of the housing prevents the internal contamination of the module by water vapor, particulate matter or other contaminants.

Opto-electronic transceiver module and hermetically sealed housing therefore

A novel optoelectronic packaging submount arrangement which incorporates a 90&deg; C. electrical conductor turn, and more specifically methods of producing optoelectronic packaging submount arrangement incorporating 90&deg; C. electrical conductor turns.

Optoelectronic packaging submount arrangement providing 90 degree electrical conductor turns and method of forming thereof

An optical subassembly (OSA), in accordance with the present invention, includes a housing, which may be substantially rectangular, the OSA includes a first end portion and a second end portion oppositely disposed from the first end portion. The first end portion forms a bore configured and dimensioned to receive a ferrule having an optical fiber therein. The bore is adjacent to a ferrule stop which is integrally formed in the housing. A lens is integrally formed with the housing. The lens has a planar surface and a convex surface opposite the planar surface. The planar surface of the lens is substantially parallel to and set in from the ferrule stop to prevent contact between the ferrule and the planar surface. The optical device, the lens, and the bore which accepts the ferrule are all in optical alignment.

Small form factor optoelectronic transceivers

Parallel optical coupling apparatus for coupling a connector attached to one end of a parallel optical cable to a receiver or transmitter array. A parallel fiber optic assembly includes a receiver or transmitter array subassembly that houses a parallel optical coupler for transferring optical signals from an array of sources (e.g., lasers) in the assembly to the connector, or from the connector to an array of receiving elements in the assembly. A connector shell is provided that properly aligns the connector with respect to the optical coupler array.

Leadframe and leadframe assembly for parallel optical computer link

An optical coupler. The coupler has an optical element for transferring an optical signal from an entrance region, external to the optical unit, to an exit region, also external to the optical unit. The coupling element has a first substantially planar transmitting surface lying in a first plane, a second substantially planar transmitting surface lying in a second plane not coplanar with the first plane, a first substantially planar reflecting surface substantially perpendicular to the first transmitting surface, and a second substantially planar reflecting surface substantially parallel to the first reflecting surface, and a shaped reflecting surface substantially perpendicular to and adjoining the first and second reflecting surfaces.

Optical coupler

Low-cost packaging for parallel optical computer link

A method for providing X,Y and Z alignment during fabrication of an optical subassembly (OSA) by active alignment and fixing with epoxy through the agency of radio frequency (RF) heating in order to provide acceptable feedback-induced noise level along with acceptable coupling efficiency.

Plastic optical subassemblies for light transfer between an optical

Growing community of inventors

Ossining, NY, United States of America

Mitchell S Cohen