Brooks Automation Gmbh

Mitchell A Drew

Ulysses Gilchrist

Robert T Caveney

Jairo Terra Moura

Jayaraman Krishnasamy

Richard S Muka

Michael W Pippins

Peter Van Der Meulen

Alexander G Krupyshev

David R Beaulieu

Douglas R Adams

A substrate processing apparatus including a frame, a first SCARA arm connected to the frame, including an end effector, configured to extend and retract along a first radial axis; a second SCARA arm connected to the frame, including an end effector, configured to extend and retract along a second radial axis, the SCARA arms having a common shoulder axis of rotation; and a drive section coupled to the SCARA arms is configured to independently extend each SCARA arm along a respective radial axis and rotate each SCARA arm about the common shoulder axis of rotation where the first radial axis is angled relative to the second radial axis and the end effector of a respective arm is aligned with a respective radial axis, wherein each end effector is configured to hold at least one substrate and the end effectors are located on a common transfer plane.

Substrate processing apparatus

A substrate processing apparatus including a chamber capable of holding an isolated atmosphere and having a front and rear disposed along a longitudinal axis and a transport apparatus located in the chamber, and having twin scara arms and a drive section with a coaxial drive shaft assembly, each shaft of which being operably connected to at least one rotatable link of both scara arms to move the twin scara arms, wherein movement of one of the twin scara arms mirrors movement of another of the twin scara arms across the longitudinal axis.

Compact processing apparatus

A substrate processing apparatus comprising a frame, at least one processing module, and a substrate transport apparatus. The frame defines a first chamber with outer substrate transport openings for transporting substrates between the first chamber and an exterior of the frame. The processing module is connected to the exterior of the frame. The processing module communicates with the first chamber of the frame through at least one of the outer openings. The substrate transport apparatus is connected to the frame for transporting substrates between the first chamber and the processing module exterior to the frame. The frame has a second integral chamber formed therein. The second integral chamber communicates with the first chamber through an internal substrate transport opening of the frame. The second integral chamber of the frame has a selectable configuration from a number of predetermined configurations. The configuration of the second integral chamber to the frame is selected in accordance with a predetermined characteristic of the substrate processing apparatus.

Substrate processing apparatus with independently configurable integral load locks

A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier, for example, used for supporting and transporting a plurality of the wafers in spaced, stacked, relationship. The carrier is supported adjacent a chamber within the load lock. A multilevel end effector associated with the load lock chamber includes a plurality of spaced end effector sets, each set being adapted to support a wafer thereon and aligned with an associated wafer supported in the carrier. The plurality of wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber for subsequent transport, for example, one at a time, into an adjacent transport chamber for delivery to a specified one of a plurality of processing stations. A mini-environment may sealingly isolate the load lock chamber and the interior of the carrier from the surrounding atmosphere. Mechanisms are provided for moving the end effector sets, both elevationally and into and out of the load lock chamber, and for moving a load lock door between a closed, sealed, position and an open position and to a parked position remote from the region adjacent the load lock chamber.

Batchloader for load lock

A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced relationship and transporting them in a particle free environment. The carrier is supported adjacent a load lock chamber also having a particle free environment. A multilevel end effector associated with the load lock chamber includes a plurality of spaced end effector sets, each set being adapted to support a wafer thereon and aligned with an associated wafer supported in the carrier. The plurality of wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber for subsequent transport, one at a time, into an adjacent transport chamber for delivery to a specified one of a plurality of processing stations. A mini-environment sealingly isolates the load lock chamber and the interior of the carrier from the surrounding atmosphere. After transfer of the plurality of wafers from the carrier to the load lock chamber, the carrier and the load lock chamber are sealed and the load lock chamber and transport chambers are evacuated. A variety of mechanisms are provided for moving the end effector sets, both elevationally and into and out of the carrier and load lock chamber, and for moving a carrier door and a load lock door between closed, sealed, positions and open positions and to a parked position remote from the region between the carrier and the load lock chamber.

Cluster tool batchloader of substrate carrier

A system is provided for batch loading semiconductor wafers into a load lock from a portable carrier used for supporting a plurality of the wafers in spaced relationship and transporting them in a particle free environment. The carrier is supported adjacent a load lock chamber which also has a particle free environment. A multilevel end effector associated with the load lock chamber includes a plurality of spaced end effector sets, each set being adapted to support a wafer thereon and aligned with an associated wafer supported in the carrier. The plurality of wafers are engaged and simultaneously retrieved as a grouping, then held in the load lock chamber awaiting further processing. A variety of mechanisms are provided for moving the end effector sets, both elevationally and into and out of the carrier and load lock chamber, and for moving a carrier door and a load lock door between closed, sealed, positions and open positions and to a parked position remote from the region between the carrier and the load lock chamber.

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Portsmouth, NH, United States of America

Mitchell A Drew