Cree Gmbh

Mitch Jackson

Ban Poh Loh

Nathaniel O Cannon

John Adam Edmond

Nicholas William Medendorp, Jr

Norbert Hiller

Bernd P Keller

Chenhua You

Barry Rayfield

Ernest W Combs

Chris Fanelli

Ernest Combs

Jr Nicholas W Mendendorp

A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.

Textured encapsulant surface in LED packages

A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Semiconductor light emitting device packages and methods

A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Methods of processing a semiconductor structure including a metal layer in the presence of organic material include flowing an aqueous mixture including an oxidizing agent over the semiconductor structure during processing of the semiconductor structure. Processing the semiconductor structure may include sawing the semiconductor structure and/or scrubbing the semiconductor structure with pressurized water. The oxidizing agent may include a peroxide, such as hydrogen peroxide, or another oxidizing agent.

Methods for reducing contamination of semiconductor devices and materials during wafer processing

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Raleigh, NC, United States of America

Mitch Jackson