Fujitsu Corporation

Fujikura Limited

Misao Umematsu

Shunichi Kikuchi

Kenji Fukuzono

Takashi Kanda

Masateru Koide

Kiyokazu Moriizumi

Norikazu Ozaki

Yasuhiro Usui

Masanori Tachibana

Manabu Watanabe

Seiji Kato

Kazuaki Satoh

Akihiro Yasuo

Kiyoshi Kuwabara

Akira Shimasaki

Naomi Fukunaga

Masahiko Sakuraoka

Yoshimi Maekawa

Yukihiro Hirano

Zhiyi Song

Kouichi Hara

Takami Sasahara

An information processing apparatus includes a substrate that includes a first connector and a second connector, a backplane that includes a third connector coupled to the first connector and a fourth connector coupled to the second connector, and a metal plate attached to the backplane, wherein the metal plate has an opening to which the fourth connector is attached, wherein the first connector is arranged near a central part of the substrate on an end side inserted into the backplane and the second connector is arranged on each side of the first connector, and wherein a clearance between the opening of the metal plate and the fourth connector increases as a distance from the third connector to the fourth connector increases.

Information processing apparatus

A cable unit includes a first casing body, a second connector body, a first connector, a second casing, and a cable. The first casing body forms an open shape that includes a first main wall and a first peripheral side-wall. The second casing body forms an open shape that includes a second main wall and a second peripheral side-wall. The second casing body is fitted together with the first casing body such that the second casing body and the first casing body configure a box-shaped casing that expands and contracts along a direction in which the first main wall and the second main wall face each other. The first connector is provided to the first main wall. The second connector is provided to the second main wall. The cable is housed in the casing and connects the first connector with the second connector.

Cable unit and server apparatus

An optical connection box includes, a plurality of first optical connectors to which a plurality of first optical paths are respectively connected, a plurality of second optical connectors that respectively include an operation unit protruding from a peripheral edge side position further from a position of the plurality of first optical connectors on a first surface of the optical connection box, and that are respectively connected to a plurality of receptacle optical connectors which are disposed in the plurality of second optical paths, a plurality of relay optical fibers in which any one of the plurality of first optical connectors is disposed in the first terminal and any one of the plurality of second optical connectors is disposed in the second terminal, and a fitting structure with respect to a substrate in which the receptacle optical connectors are disposed.

Optical connection box

An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Electronic device

A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrateof the invention is such that an openingis formed in a first substrate, a thin film substrate (a second substrate)is laminated on the first substrate, the openingis covered with the thin film substrate. Next, a capacitor (a first electronic part)is inserted into the openingand bonded to the thin film substrate, a resinfills an interior of the openingto a fixed or larger thickness and is hardened, the thin film substrateand the capacitorare thereby sustained by the resin, an LSI(a second electronic part) that should be connected to the capacitoris bonded to a surface, on an exposed side, of the thin film substrate, and the capacitoris connected to the LSI

Packaging method, packaging structure and package substrate for electronic parts

A semiconductor device includes a semiconductor bare chip and an electrically-insulative board member with a thin-film structure capacitor. The semiconductor bare chip has a power supply terminal and a grounding terminal on the back surface thereof. The semiconductor bare chip is mounted on a circuit board by flip-chip bonding. The board member includes a board and a thin-film structure capacitor provided on the board. The capacitor has terminals corresponding to the power supply terminal and the grounding terminal of the semiconductor bare chip thereon. The side of the board member where the capacitor is provided is bonded to the back surface of the semiconductor bare chip. The terminals of the capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.

Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding

A dummy pad is formed through a polyimide insulating layer so as to be provided opposite to a via connecting pad formed on the surface of a ceramic substrate. A defect occurring in the via connecting pad is filled with a protrusion when the dummy pad is formed. Accordingly, the influence of the defect upon a layer above the dummy pad is prevented. Further, in a method for manufacturing a thin film wiring board obtained by forming a thin film layer on a base substrate having a via that allows interlayer electric conduction, a void defect existing in the via is filled with a conductive material having corrosion resistance against an etchant, and then the thin film layer is formed on the base substrate.

Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same

A multi-layer wiring substrate includes a main substrate and a plurality of insulating films stacked on the main substrate. The plurality of insulating films have wiring patterns formed on wiring regions thereof and dummy wiring patterns formed on peripheral regions of the wiring regions. The wiring patterns include signal wiring patterns, power supply wiring patterns, and vias. The dummy wiring patterns correspond to the wiring patterns, respectively.

Multi-layer wiring substrate

A connector comprising a plug member having pin-like male contacts and a jack member having female contacts, the jack member being coupled with the plug member by a plug-in connection. A skirt having a plurality of holes is arranged to hold the pin-like male contacts in position. The skirt is supported in the plug member by the locating groove-pin engagement. The locating groove-pin engagement is released by the jack member when the jack member is inserted into the plug member and reestablished by the jack member when the jack member is withdrawn from the plug member. The skirt also has an alignment pin which is received in a locating hole of the jack member when the jack member is inserted into the plug member. Therefore, it is possible to insert the jack member in the plug member without the pin-like male contacts being bent, as well as to easily withdraw the jack member from the plug member.

Growing community of inventors

Kawasaki, Japan

Misao Umematsu