Nec Corporation

Misao Iwatare

Satoru Onodera

Makoto Moribe

Toshio Nakanishi

Keijirou Kadomatsu

Toshimasa Umetsu

Toshiki Shimasaki

Keijiro Kadomatsu

A casing for a battery of the present invention is made up of a top-open box and a lid closing the open top of the box. The lid has a pyramidal top portion formed with a plurality of vent holes for allowing a gas to pass therethrough. A polymeric osmotic film allowing a gas to pass therethrough, but intercepting water, is fitted in each of the vent holes. The casing therefore vents hydrogen output from a battery while preventing water from entering it.

Casing for a battery

A door structure for cabinets according to the invention is configured in a double structure wherein a front door 1 of a cabinet 5 comprises a main surface part 1A, which constitutes the external face, and a metallic meshed member 4, which constitutes the internal face. In the main surface part 1A and the top, bottom, right and left side members 1B through 1E of the door are bored pluralities of ventilation holes 2 and 3, respectively, so that air, entering through lower holes and warmed inside, is discharged through upper holes by such actions as conduction and stirring within the cabinet 5. This structure can enhance both the electromagnetic shielding performance and the cooling effect.

Door structure for cabinets

A double wall casing structure includes an inner casing for housing heat generating equipment and an outer casing surrounding the inner casing to form an air layer therebetween. One or more fans are provided in the air layer and are operated temperature-responsively for steering air within the air layer. At lest one selectively operable valve is located in the outer casing. The valve is adapted to be automatically closed/opened responsive to sensed temperature conditions.

Protective casing structure for electronic apparatus

In a printed circuit board assembly comprising vertical printed circuit boards, perpendicular printed circuit boards, which are perpendicular to the vertical printed circuit boards, are disposed horizontally. A vertical back-board module is used. A vertical front board is arranged parallel in front of the vertical back-board module and has a front surface and a back surface. A connector group attaches the vertical back-board module to the back surface. With vertical attaching and receiving connectors, the vertical printed circuit boards are attached perpendicularly to the vertical front board. Similarly, the perpendicular printed circuit boards are attached perpendicularly to the back board module with perpendicular attaching and receiving connectors.

Printed circuit board assembly of vertical and horizontal printed boards

An electronic device package accommodatable in an electronic device casing. When a high density multipin connector is caused to mate with a connector mounted on the casing, the former is once brought to a stop just before mating with the latter and, therefore, prevented from rapidly mating with the latter. This eliminates the damage to the body of the connector and the deformation of the pins of the connector.

Growing community of inventors

Tokyo, Japan

Misao Iwatare