Tdk Corporation

Misaki Tabata

Kazunari Kimura

Akira Nakamura

Isao Abe

Shigemitsu Tomaki

Yasuharu Miyauchi

Yousuke Futamata

Kenichi Tezuka

Noriyuki Saito

An antenna device includes: a dielectric layer; radiation conductors and a ground conductor disposed at the dielectric layer; and side surface conductors in which a plurality of conductor patterns are laminated, the side surface conductors are disposed on an outer side of the ground conductors in a first direction in plan view seen from a normal direction of the radiation conductors, and the dimensions of the side surface conductors in a second direction perpendicular to the first direction are larger than the dimensions in the second direction of the radiation conductors.

Antenna device and antenna module

The object of the present invention is to provide a black marker composition capable of forming non-metal marker which sufficiently ensures the adhering strength and the contrast against the foundation; the electronic component comprising the marker made of said black marker composition, and further the communication device comprising said electronic component. The marker composition according to the present invention comprises a borosilicate glass, and a black oxide including Cr, Mn and one or more elements selected from the group consisting of Fe, Ni, Cu and Co.

Black marker composition and an electronic component using these

A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90&#xb0;, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.

Method for producing laminated electronic component, and laminated electronic component

Growing community of inventors

Tokyo, Japan

Misaki Tabata