Kabushiki Kaisha Toshiba

Misa Sawanobori

Yasuyuki Hotta

Toshiro Hiraoka

Shigeru Matake

Hideo Aoki

Naoko Yamaguchi

Yoshiaki Sugizaki

Mitsuyoshi Endo

Kou Yamada

An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Method for connecting electronic device

Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well as to a second major surface of the porous substrate, and a conductive portion formed on the first major surface of the porous substrate and formed at least partially an inter-penetrating structure together with the porous substrate at an interface of the porous substrate. The apertures of the open-cells on the first major surface have an average diameter and an average number of the apertures, at least one of which is smaller than that of the second major surface.

Wiring member and method of manufacturing the same

A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

Semiconductor test unit having low contact resistance with examined electronic products, semiconductor contact board, method for testing semiconductor device, semiconductor device, and method for manufacturing thereof

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Yokohama, Japan

Misa Sawanobori