Ipg Photonics Corporation

Other

Ipg Microsystems LLC

Lilogix, Inc.

Rd Automation

Besi North America, Inc.

Miroslaw Sokol

Jeffrey P Sercel

Marco Mendes

Joshua Schoenly

Mathew Hannon

Rouzbeh Sarrafi

Xiangyang Song

Lawrence Roberts

Terrence A Murphy, Jr

Zvi Bendat

Tom Loomis

Donald J Lemmo

John D Moore

Lawrence F Roberts

Jr Terrence A Murphy

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Multi-laser system and method for cutting and post-cut processing hard dielectric materials

System and method for laser beveling and/or polishing

Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Laser machining systems and methods with vision correction and/or tracking

A robotic die sorter having pick and place arm assemblies and a multi-camera optical inspection system is disclosed. A pick arm of the pick arm assembly picks a die from a semiconductor wafer, and a place arm of the place arm assembly receives the die from the pick arm and places same in a reel of pocketed tape. After picking, the pick arm and the place arm are rotated into facing arrangement, whereupon the die is transferred to the place head of the place arm and a camera of the optical inspection system to detect defects in the die. After inspection, the place arm rotates toward the pocketed tape and places the die into the pocketed tape. Additional cameras of the optical inspection system allow for calibration of the pick and place arms, as well as monitoring of the die transfer process.

Robotic die sorter with optical inspection system

An optical probe for use in accurately aligning the surfaces of microelectronic components that are to be joined together includes an optical device adapted to superimpose the images of a pair of components positioned on either side of the device. The optical device comprises an optical beam-splitter and plurality of prisms having mirror surfaces arranged so that the superposition of images takes place at the partially reflective interface within the beam-splitter. The resulting superimposed image of the die and substrate is displaced laterally from the microelectronic components so that the image is not projected onto either component.

Optical system for aligning a pair of objects

Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

Mounting apparatus for electronic parts

Mounting apparatus for electronic parts is disclosed. More particularly, the mounting apparatus includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

Growing community of inventors

Bedford, NH, United States of America

Miroslaw Sokol