Taiwan Semiconductor Manufacturing Comp. Ltd.

Mirng-ji Lii

Ming-Da Cheng

Hui-Min Huang

Kuo-Chin Chang

Chang-Jung Hsueh

Hao-Chun Liu

Wan-Yu Chiang

Yen-Kun Lai

Wei-Hsiang Tu

Wei-hung Lin

A semiconductor device including a semiconductor die, a first conductive pad, a second conductive pad, a first connector structure and a second connector structure is provided. The first conductive pad is disposed on the semiconductor die, wherein the first conductive pad has a first lateral dimension. The second conductive pad is disposed on the semiconductor die, wherein the second conductive pad has a second lateral dimension. The first connector structure is disposed on the first conductive pad, wherein the first connector structure has a third lateral dimension greater than the first lateral dimension. The second connector structure is disposed on the second conductive pad, wherein the second connector structure has a fourth lateral dimension smaller than the second lateral dimension.

Semiconductor device

Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Package structure and method of forming the same

Growing community of inventors

Hsinchu County, Taiwan

Mirng-ji Lii