Stmicroelectronics S.r.l.

Mirko Alesi

Matteo De Santa

Andrea Albertinetti

A leadframe includes a die pad having arranged thereon a first semiconductor die with an electrically conductive ribbon extending on the first semiconductor die. The first semiconductor die lies intermediate the leadframe and the electrically conductive ribbon. A second semiconductor die is mounted on the electrically conductive ribbon to provide, on the same die pad, a stacked arrangement of the second semiconductor die and the first semiconductor die with the at least one electrically conductive ribbon intermediate the first semiconductor die and the second semiconductor die. Package size reduction can thus be achieved without appreciably affecting the assembly flow of the device.

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Milan, Italy

Mirko Alesi