Growing community of inventors

Horseheads, NY, United States of America

Mircea Despa

Average Co-Inventor Count = 4.64

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 33

Mircea DespaEric John Mozdy (1 patent)Mircea DespaJoydeep Lahiri (1 patent)Mircea DespaPo Ki Yuen (1 patent)Mircea DespaKenneth Richard Miller (1 patent)Mircea DespaStephen Joseph Caracci (1 patent)Mircea DespaDavid M Root (1 patent)Mircea DespaRichard Curwood Peterson (1 patent)Mircea DespaBrian L Webb (1 patent)Mircea DespaKeith A Horn (1 patent)Mircea DespaStephen Charles Currie (1 patent)Mircea DespaJinlin Peng (1 patent)Mircea DespaPaul Martin Elliott (1 patent)Mircea DespaMichael Donavon Brady (1 patent)Mircea DespaMark D Salik (1 patent)Mircea DespaDale Russell Hess (1 patent)Mircea DespaJames B Stamatoff (1 patent)Mircea DespaChristine Marie Share (1 patent)Mircea DespaMircea Despa (4 patents)Eric John MozdyEric John Mozdy (33 patents)Joydeep LahiriJoydeep Lahiri (28 patents)Po Ki YuenPo Ki Yuen (23 patents)Kenneth Richard MillerKenneth Richard Miller (21 patents)Stephen Joseph CaracciStephen Joseph Caracci (18 patents)David M RootDavid M Root (18 patents)Richard Curwood PetersonRichard Curwood Peterson (17 patents)Brian L WebbBrian L Webb (16 patents)Keith A HornKeith A Horn (14 patents)Stephen Charles CurrieStephen Charles Currie (11 patents)Jinlin PengJinlin Peng (10 patents)Paul Martin ElliottPaul Martin Elliott (5 patents)Michael Donavon BradyMichael Donavon Brady (3 patents)Mark D SalikMark D Salik (3 patents)Dale Russell HessDale Russell Hess (2 patents)James B StamatoffJames B Stamatoff (2 patents)Christine Marie ShareChristine Marie Share (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Corning Incorporated (4 from 7,268 patents)


4 patents:

1. 8449283 - Dies for forming extrusions with thick and thin walls

2. 8076057 - Methods of making extrusion dies

3. 7332328 - Microcolumn-platform based array for high-throughput analysis

4. 6985664 - Substrate index modification for increasing the sensitivity of grating-coupled waveguides

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12/5/2025
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