Intel Corporation

Miranda Ngan

Aleksandar Aleksov

Telesphor Kamgaing

Srinivas V Pietambaram

Kristof Darmawikarta

Benjamin Duong

An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate, a plurality of integrated circuit devices electrically attached to the package substrate, wherein each integrated circuit device of the plurality of integrated circuit devices includes an active surface and a backside surface, and wherein a first integrated circuit device and a second integrated circuit device of the plurality of integrated circuit devices includes radio frequency logic circuitry and a radio frequency antenna formed in or attached thereto, and a radio frequency waveguide on the backside surface of the first integrated circuit device and on the backside surface of the second integrated circuit device.

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Chandler, AZ, United States of America

Miranda Ngan