Shin-Etsu Chemical Co., Ltd.

Nissin Chemical Industry Co., Ltd.

Mio Sakai

Yoshinori Inokuchi

One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin while having softness derived from silicone rubber and have excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing the same. The other purpose is to provide a thermosetting resin composition and an encapsulating material, each comprising the fine particles. The present invention provides an epoxy-modified silicone fine particle composed of (A) a spherical silicone rubber fine particle coated with (B) polyorganosilsesquioxane, wherein the spherical silicone rubber fine particle (A) has an average particle diameter of 0.1 to 100 μm and the polyorganosilsesquioxane (B) has an epoxy group-containing organic group.

Epoxy-modified silicone fine particle, a method for preparing the same, a thermosetting resin composition comprising the fine particles and an encapsulating material

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Echizen, Japan

Mio Sakai