Tesa Se

Minyoung Bai

Klaus Keite-Telgenbüscher

Bernd Lühmann

Thilo Dollase

Christian Schuh

Thorsten Krawinkel

Jan Ellinger

Anika Petersen

Judith Grünauer

Monika Junghans

Chris Gäbert

Lesmona Scherf

A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Pressure-sensitive adhesive compound containing a cross-linked nanoparticle network, method of production and use thereof

Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23&#xb0; C., and the second phase, after the build up reaction, having a softening temperature of greater than 23&#xb0; C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances.

Linear for protection of adhesives

An adhesive tape containing an adhesive comprising

Adhesive tape featuring adhesive with continuous polymer phase

In the case of a liner for the protection of adhesives, the protective effect is to be enhanced in respect of permeates originating from the environment and also permeates included during winding or stacking and other processing steps. This enhancement is accomplished through provision of a liner which comprises at least one adhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance.

Liner for protection of adhesives

Liner for protecting adhesives with respect to permeates originating from the surroundings or included during winding, stacking or other process steps, having at least one non-stick release layer and at least one getter material that is able to absorb at least one substance capable of permeation, the getter material being contained as a dispersed phase in at least one layer of the liner.

Liner for protecting adhesive compounds

The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.

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Hamburg, Germany

Minyoung Bai