Samsung Electronics Co., Ltd.

Knu-lndustry Cooperation Foundation

Minwoo Rhee

Junhyung Kim

Minsoo Han

Juhyung Lee

Kyoungwhan Oh

Sunwoo Park

Kyeongbin Lim

Hyunjin Lee

Jungwoo Cho

Inbae Chang

Seungdon Lee

Sujie Kang

Jungshin Lee

Daeho Min

Mngu Lee

A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

Substrate transfer apparatus

A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.

3D printing apparatus and 3D printing method

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

Substrate bonding apparatus

Growing community of inventors

Seoul, South Korea

Minwoo Rhee