Future Wei Technologies, Inc.

Minwei Gong

Daniel Plaza

Alexis Pierides

Shengjun Ou

Zhengxiang Ma

On-board heat dissipation can be achieved in radio frequency (RF) modules by integrating a heat sink into the RF module's antenna reflector. Said integration achieves a compact and aesthetically pleasing RF module design that reduces the overall footprint of modular active antenna systems (AASs). Embodiment antenna reflectors include portions that are perforated and/or exposed to free flowing air to provide enhanced heat dissipation capability.

Active antenna system (AAS) radio frequency (RF) module with heat sink integrated antenna reflector

Heat dissipation in vertically arrayed host device configurations can be improved through inclusion of heat sinks having split-stream fin architectures. The split-stream fin architecture includes two or more sets of angled fins separated by a central conduit, which allows for more efficient inflow and/or expulsion of convection cooling air over the heat sink. The split-stream fin arrangement may include inwardly angled fins in order to draw convection cooling air inwards from horizontal inlets, in which case warm exhaust is expelled through the central conduit. Conversely, the split-stream fin arrangement may include outwardly angled fins, which draw convection cooling air from the central conduit, and expel warm air through horizontal exhausts. The split-stream fin arrangements function well when host devices are configured horizontally, which allows for more flexible host device configurations.

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Wilmington, DE, United States of America

Minwei Gong