Samsung Electronics Co., Ltd.

Knu-lndustry Cooperation Foundation

Minsoo Han

Junhyung Kim

Kyeongbin Lim

Minwoo Rhee

Hyunjung Kim

Kwangjin Moon

Hoonjoo Na

Taeyeong Kim

Jun Hyung Kim

June Hyun Jang

Jewon Lee

Deokhee Han

Gwanghee Jo

Seungdae Seok

Inbae Chang

Jongkwan Lee

Sangcheol Bong

Daeho Min

Mngu Lee

Hyeonjun Yun

A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

Substrate transfer apparatus

A light emitting diode (LED) driving device is provided. The LED driving device includes a rectifier configured to generate a rectified voltage, wherein the rectifier is directly connected to an input node of a light source including LEDs; a regulator configured to output a direct current (DC) power supply voltage using the rectified voltage; a microcontroller including a control terminal and a power terminal, wherein the microcontroller is configured to generate a dimming control signal based on a voltage input, receive the DC power supply voltage through the power terminal and output the dimming control signal through the control terminal; a driver configured to control an LED current to flow through the LEDs based on the dimming control signal; and a switch connected between a control node and a ground node, wherein an output terminal of the regulator and the control terminal are connected to the control node.

LED driving device and lighting device including the same

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

Substrate bonding apparatus

A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.

Wafer to wafer bonding apparatuses

A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.

Substrate bonding apparatus and bonding method using the same

Growing community of inventors

Hwaseong-si, South Korea

Minsoo Han