Kabushiki Kaisha Shinkawa

Toto Ltd.

Minoru Torihata

Nobuto Yamazaki

Shinji Maki

Tatsunari Mii

Kuniyuki Takahashi

Takayuki Iiyama

Koichi Harada

Kazuo Sugiura

Mitsuaki Sakakura

Hiroto Urabayashi

Osamu Nakamura

Yoshimitsu Terakado

Ryuichi Kyomasu

Hiroshi Ushiki

Yuji Ohashi

Kazumasa Kimura

Toshimichi Miyahara

Mamoru Sakurai

Takesi Suzuki

An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

XY table for a semiconductor manufacturing apparatus

A wire bonding capillary (,), which is able to decrease wire extraction resistance and suitable for a long and low loop wire bonding process, comprises a through bore (,) for feeding a bonding wire, a funnel-shaped bore (,) for guiding the wire to the through bore, and a tapered portion (,) formed at an exit of the through bore. The through bore length is between 0.2 and 1.5 times the through bore diameter. The tapered portion is tapered in two steps.

Wire bonding capillary

A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.

Guide rail mechanism for a bonding apparatus

A guide rail mechanism used for, for instance, a die boding apparatus and a wire bonding apparatus, including a pair of guide rail sections that face each other and convey a workpiece such as a lead frame in between. The guide rail sections include rail height adjustment spacers held by spring force between guide rails and guide rail stands, and this rail height adjustment spacer is replaced for other rail height adjustment spacers of different thicknesses by moving guide rail raising-and-lowering shafts by way of overcoming the spring forces of the springs provided thereon, thus assuring the same upper surface height level of workpieces of different thicknesses to be conveyed.

In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-'on'/power-'off' combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.

Wire cutting and feeding device for use in wire bonding apparatus

A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.

Wire bonding method

In a wire bonding apparatus that includes an air-blower connected to a compressor via an electromagnetic valve so as to provide a bonding wire with back tension by blowing air to the bonding wire, a preparatory tank which can store air is installed between the air-blower and the electromagnetic valve so as to avoid abrupt fluctuations or periodic fluctuations of the air supplied to the air-blower.

Wire bonding apparatus

A bonding apparatus including a pair of guide rails, a main heating block and a pair of pre-stage and after-stage heating blocks so as to heat a lead frame conveyed on the pair of guide rails, and the pre-stage and after-stage heating blocks can be moved in the direction of width of the lead frame together with one of the pair of guide rails and are installed so that they are positioned beneath the other frame guide rail.

Bonding apparatus with adjustable heating blocks, clamps, and rails

A capillary for a wire bonding apparatus having a wire threading hole and a chamfer, in which the wire threading hole is formed in two stages as first and second wire threading holes, the diameter of the first wire threading hole which is located above the second wire threading hole exceeds the diameter of a bonding wire by no more than 3 to 8 microns, the diameter of the second wire threading hole is 5 to 10 microns greater than the first hole diameter, and the depth of the second wire threading hole is 10 to 50 microns.

Capillary for use in a wire bonding apparatus

In a capillary used in a wire bonding apparatus that has a wire threading hole through which a bonding wire of 10 to 30 .mu.m diameter passes and is provided with two chamfers, i.e., lower and upper chamfers, near the tip end of the wire threading hole, the upper chamfer has a chamfer angle of 3 to 19 degrees and a depth of 20 to 50 microns.

Capillary for a wire bonding apparatus

A clamping device used in, for instance, a bonding machine, using a piezo-electric element for opening and closing a pair of clamping claws for holding, for instance, bonding wires in between. The clamping device includes a pressure adjustment screw which applies a preparatory pressure to the piezo-electric element via a contact plate, and the contact plate is connected, via flexible sections which are capable of expansion and contraction, to a screw attachment with which the pressure adjustment screw is screw-engaged.

Clamping device

A device for applying tension to a bonding wire installed between a wire spool and a capillary of a wire bonding apparatus including a nozzle for blowing out a gas for applying tension to the wire and a single gas guide plate installed along the direction of the flow of the gas blown out of the nozzle so as to guide the gas to the bonding wire.

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which is placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking air from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Non-contact type moving table

A non-contact type moving table including a guide table having a flat guide surface at the top and a moving table which placed on the guide table and has a moving surface which faces the guide surface of the guide table. The moving table has air blowing openings that blow out compressed air towards the guide surface of the guide table and air suction openings sucking from the guide surface of the guide table, thus obtaining a single plane, non-contact type bearing or supporting system via the guide surface and the moving surface. As a result, the structure is simple and overall size can be small with low manufacturing costs. In addition, a wide range of materials can be used to build the moving table system.

Growing community of inventors

Musashimurayama, Japan

Minoru Torihata