Kabushiki Kaisha Toshiba

Minoru Togashi

Nobuhiro Furudate

Fumio Takahashi

Mitsuo Mori

Mitsugu Miyamoto

Yutaka Fukuoka

Katsuyoshi Inoue

According to this invention, there is disclosed a resin-seal apparatus for a semiconductor element, including cavity blocks arranged to be opposite to each other and having a semiconductor element to be molded, ejector plates arranged to correspond to the cavity blocks, respectively, ejector pins and support pins arranged between the ejector plates and the cavity blocks, a pair of first annular heat-plate molding die sets arranged to surround the ejector plates arranged to correspond to the cavity blocks, a second heat-plate molding die set arranged below a corresponding one of the ejector plates, a plate holder below the second heat-plate molding die set, a gap portion and an elastic member formed between the plate holder and the second heat-plate molding die set, vertically movable connecting rods arranged through the gap portion and each having one end connected to a side surface of the corresponding one of the ejector plates, a stepped bolt engaged with the other end of each of the connecting rods, and push-up rods for pushing up the stepped bolts.

Resin-seal apparatus for semiconductor element

A method of bending outer leads of a semiconductor device, wherein the outer leads arranged substantially horizontally are preparatorily bent upward or downward from their roots, and thereafter bent into a predetermined configuration, thereby to obtain final outer leads.

Method of bending outer leads of a semiconductor device

For improving both coplanarity and bending accuracy of gull wing type outer leads of electronic parts such as resin molded semiconductor devices, quad flat packages, etc., a lead forming machine is used which incudes a bending die and a stripper which have a pair of faced projections at both sides thereof, and bending punches vertically moving through perforations of the stripper. An electronic part with gull wing type outer leads is disposed between the bending die and the stripper in such a manner that the outer leads extend horizontally from the projections of the bending die. In this case, both sides of outer leads are placed on projections of the bending die without clamping them with the faced projections of the bending die and the stripper. The bending punches are depressed through perforations of the stripper to perform primary lead forming for the outer leads. Thereafter, the bending punches are further depressed to carry out secondary lead forming for the outer leads, while clamping flat portions of outer leads with the faced projections.

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Chigasaki, Japan

Minoru Togashi