Shin-etsu Chemical Co., Ltd.

Minoru Takei

Toshio Shiobara

Hisashi Shimizu

Yoshio Fujimura

Tetsuo Yoshida

Masachika Yoshino

Phosphonium borate compounds of formula (1) are novel.

Phosphonium borate compound, making method, curing catalyst, and epoxy resin composition

In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Epoxy resin composition and semiconductor device

A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

Thermosetting resin compositions

An epoxy resin composition comprising an epoxy resin, a curing agent, a substantially pure alpha-alumina filler, and a silicone-modified epoxy or phenol resin is useful in encapsulating semiconductor devices. The composition can be molded and cured into a product having improved thermal conductivity and moisture resistance.

Semiconductor encapsulating epoxy resin compositions and semiconductor

A silicone composition adapted for impregnation of electronic parts comprising a vinyl group-containing organopolysiloxane, an organopolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule and a peroxide compound. The peroxide compound is soluble in both organopolysiloxanes and is contained in an amount of from 0.1 to 10 parts by weight per 100 parts by weight of the total of the organopolysiloxanes. The composition has a viscosity which is sufficient to allow easy impregnation, and is in the range of from 20 to 400 centistokes at 25.degree. C.

Growing community of inventors

Gunma, Japan

Minoru Takei