Tdk Corporation

Other

Minoru Takaya

Hisashi Kobuke

Toshikazu Endo

Yoshiaki Akachi

Hiroyuki Uematsu

Masami Sasaki

Kenichi Kawabata

Hisayuki Abe

Yoshinori Mochizuki

Katsuharu Yasuda

Atsushi Sato

Kei Suzuki

Yuji Akimoto

Akihiko Fujisawa

Kazuro Nagashima

Takuya Aoki

Toshiyuki Abe

Kazuhiko Itoh

Kosuke Takano

Atsuyuki Nakano

Munemitsu Hamada

Hisanao Tosaka

Tomohiro Sogabe

Hiroshige Ohkawa

Takashi Kajino

Tetsuo Takahashi

Shigeru Moriya

Seiji Takahara

Masahiro Ikemoto

Akinori Oi

A module with embedded semiconductor IC of the present invention includes a first resin layer, a second resin layer, post electrodes passing through the first and second resin layers, and a semiconductor IC mounted as embedded between the first resin layer and the second resin layer. Stud bumps are formed on land electrodes of the semiconductor IC and positioned with respect to the post electrodes. Owing to this positioning of the stud bumps formed on the semiconductor IC with respect to the post electrodes, the planar position of the stud bumps is substantially fixed. As a result, it is possible to use a semiconductor IC having a very narrow electrode pitch of 100 &#x3bc;m or smaller, particularly of around 60 &#x3bc;m.

Module with embedded semiconductor IC and method of fabricating the module

A method for manufacturing magnetic metal powder is provided. In the method, a powdered magnetic metal oxide is supplied to a heat treatment furnace with a carrier gas composed of a reducing gas. The heat treatment furnace is maintained at temperatures above a reducing action starting temperature for the powdered magnetic metal oxide and above a melting point of the magnetic metal in the powder. The powdered magnetic metal oxide is subject to a reducing process, and then magnetic metal particles, the resultant reduced product, is melted to form a melt. The melt is re-crystallized in a succeeding cooling step, to obtain single crystal magnetic metal power in substantially spherical form.

Method for manufacturing magnetic metal powder, and magnetic metal powder

A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 &#x3bc;m and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.

Method for manufacturing spherical ceramic powder

A core material-including organic core board or inorganic sintered boardhaving a plurality of band-shaped conductor patternsformed on its front and rear surfaces is sliced in a direction crossing the band-shaped conductor patterns. End portions of the band-shaped conductor patternsexposed on each of cut surfaces of the core boardare connected to one another by bridging conductor patterns formed on the cut surfaces. In this manner, at least one helical coil is provided. The inner diameter of the helical coil can be kept constant while coil pitch accuracy can be kept good.

Inductive device and method for producing the same

A laminated electronic component including at least one inductance element and produced from a laminate having electrical insulators and electrical conductors laminated alternately. The inductance element is formed as a helical coil having a plurality of turns each constituted by four sides. The inductance element has pairs of parallel conductor pieces and pairs of bridging conductor pieces. Each pair of parallel conductor pieces form two of the four sides of one turn of the coil. Each pair of bridging conductor pieces form the other two sides of one turn of the coil. Grooves are formed in the laminate to thereby form the parallel conductor pieces. The grooves are filled with an electrically insulating material. The bridging conductor pieces are formed on the electrically insulating material.

Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module

A composite magnetic material including a resin and generally spherical magnetic metal particles of at least one type dispersed in the resin and consisting essentially of single crystal grains, the metal particles having a mean particle size of 0.1 to 10 &#x3bc;m and each having an insulating coating layer at least partially coated thereon.

COMPOSITE MAGNETIC MATERIAL AND MAGNETIC MOLDING MATERIAL, MAGNETIC POWDER COMPRESSION MOLDING MATERIAL, AND MAGNETIC PAINT USING THE COMPOSITE MAGNETIC MATERIAL, COMPOSITE DIELECTRIC MATERIAL AND MOLDING MATERIAL, POWDER COMPRESSION MOLDING MATERIAL, PAINT, PREPREG, AND SUBSTRATE USING THE COMPOSITE DIELECTRIC MATERIAL, AND ELECTRONIC PART

The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with a smaller pitch. A fluxcontains an adhesive resin and a hardening agent. This flux or a soldering paste containing the flux is applied onto a component mounting board, and then, an electronic componentis mounted and soldered onto the component mounting board

Soldering flux, solder paste and method of soldering

A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.

COMPOSITE DIELECTRIC MATERIAL, COMPOSITE DIELECTRIC SUBSTRATE, PREPREG, COATED METAL FOIL, MOLDED SHEET, COMPOSITE MAGNETIC SUBSTRATE, SUBSTRATE, DOUBLE SIDE METAL FOIL-CLAD SUBSTRATE, FLAME RETARDANT SUBSTRATE, POLYVINYLBENZYL ETHER RESIN COMPOSITION, THERMOSETTIN

A method for manufacturing single crystal ceramic powder is provided. The method includes a powder supply step for supplying powder consisting essentially of ceramic ingredients to a heat treatment area with a carrier gas, a heat treatment step for heating the powder supplied to the heat treatment area at temperatures required for single-crystallization of the powder to form a product, and a cooling step for cooling the product obtained in the heat treatment step to form single crystal ceramic powder. The method provides single crystal ceramic powder consisting of particles with a very small particle size and a sphericity being 0.9 or higher.

Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element

This invention has an object of providing a method for producing a multilayer substrate or an electronic part wherein decrease in the thickness has been enabled without causing the problem of insufficient strength or the like in the handling, as well as the electronic part. Such object has been attained by a method for producing a multilayer substrate or an electronic part comprising the steps of adhering a conductor layer to a transfer film, patterning the conductor layer to form a predetermined pattern, placing the transfer film overlaid with the patterned conductor layer on a prepreg so that the side of the conductor layer faces the prepreg, and then adhering the transfer film to the prepreg by applying heat and pressure and peeling the transfer film to produce the prepreg having the conductor layer formed thereon; and the multilayer electronic part produced by such method.

Method for producing multilayer substrate and electronic part, and multilayer electronic part

A ferrite fine powder having a mean particle size of 0.1 to 30 &mgr;m and made of spherical single-crystal particles. The ferrite fine powder has superior physical properties and excellent magnetic properties desirable for use as a raw material for a dust core of coils, transformers, etc. The powder is prepared by forming a solution or suspension containing a compound or compounds of at least one of the metals forming the ferrite into fine droplets, and thermally decomposing the droplets at elevated temperatures.

Single-crystal ferrite fine powder

The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the core substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Electronic parts and method producing the same

Using plural layers selected from among composite resin substrates having a fully high or low dielectric constant, composite resin substrates having a fully high magnetic permeability, and composite resin substrate layers having a fully high Q value, the invention provides a multilayer electronic part of small size having high performance and improved overall electrical characteristics. The multilayer electronic part includes constituent layers of at least two types formed of composite materials and a conductor layer formed on at least one composite material layer, wherein the conductor layer constructs a predetermined electric circuit.

Electronic parts

The present invention relates to a laminated chip bead element demonstrating noise absorption characteristics over a broad range in a high frequency range of GHz or higher. An insulating body is constituted of a material achieved by mixing ferrite powder and an insulating resin. At least one signal conductor is embedded in the insulating body. It is desirable that the insulating body includes a plurality of composite members.

Growing community of inventors

Tokyo, Japan

Minoru Takaya