Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Electric Corporation

Minoru Tajima

Toru Nagase

Nobuhiro Tokumori

Takashi Katagi

Masato Inoue

Nobutake Orime

In a microstrip antenna in which a ground conductor is provided to be opposed to patch conductors, wedge shapes angled to intersect with an antenna polarization plane are provided at edges of the ground conductor in a repeated manner.

Microstrip antenna and radar module

An emblem includes a first thickness portion having a first thickness and a second thickness portion having a second thickness thinner than the first thickness. The first thickness is equal to an integral multiple of a half of an in-medium wavelength of the radar wave inside the first thickness portion. The second thickness is a thickness equal to an integral multiple of a half of the in-medium wavelength of the radar wave inside the second thickness portion. A difference between the first thickness and the second thickness is set to an integral multiple of a free-space wavelength of the radar wave.

Emblem

There is provided an IC package provided with one or more bare chips mounted on a chip carrier, a plurality of first bumps each for connecting a chip electrode to a conductive pad disposed on an upper surface of the chip carrier, a plurality of second bumps each connected to a conductive pad disposed on a bottom surface of the chip carrier, and a plurality of vias for connecting between conductive pads disposed on the upper and bottom surfaces of the chip carrier. A differential pair of lines are exposed on the upper surface of the chip carrier. High-frequency signals to be processed by the one or more bare chips are transmitted by way of the differential pair of lines, and other signals are transmitted by way of the plurality of second bumps.

IC package, optical transmitter, and optical receiver

A balun includes a first conductive layer disposed on a top surface of a substrate, a second conductive layer having a shorter length than the first conductive layer and disposed on the top surface of the substrate, the second conductive layer having first and second end portions, a substrate having a through hole electrically connected to the second end portion of the second conductive layer, and a third conductive layer disposed on a bottom surface of the substrate, the third conductive layer having a first end portion electrically connected to the second end portion of the second conductive layer via the through hole, and the third conductive layer being tapered from a maximum width at the second end portion thereof to a minimum width at the first end portion thereof.

Balun and semiconductor device including the balun

A method of and an apparatus for measuring the null angle in the difference vs. sum pattern and in the difference pattern of a monopulse antenna. The null angle of the monopulse antenna in the radiation pattern is acquired by transmitting an RF signal from a plurality of antenna elements to the monopulse antenna, acquiring the sum signal and difference signals in the directions of the respective antenna elements and acquiring the null angle in accordance with the sum and difference signals. The apparatus comprises a rotator for changing the direction of the monopulse antenna and a transmitting antenna facing the monopulse antenna for transmitting a test signal to the monopulse antenna.

Growing community of inventors

Tokyo, Japan

Minoru Tajima