Tdk Corporation

Mitsumi Electric Company Ltd.

Nihon Dempa Kogyo Co., Ltd.

Nrs Technologies, Inc.

Jfe Chemical Corporation

Minoru Sakai

Yasushi Yamamoto

Takayuki Nakamura

Hiroshi Kawahara

Hideyuki Sasaki

Yoshihiro Takahashi

Toshimasa Tsuda

Tadaaki Tsuda

Ryosuke Matsuwake

Akira Komiya

Seiji Abe

Natsuhiko Sakairi

Tomoyuki Tahara

Disclosed herein is a non-reciprocal circuit device includes: a first substrates including a magnetic plate having a circular surface and a dielectric ring having an annular surface, the circular surface and the annular surface being substantially coplanar; a second substrate; a center conductor provided between the first substrate and the second substrate; and a permanent magnet that applies a magnetic field to the center conductor. The center conductor includes: a main conductor portion positioned on a straight line extending from a center of the circular surface to an outer periphery of the annular surface; and a protrusion portion having a width smaller than a width of the main conductor portion, and wherein at least a part of the protruding portion is positioned on the annular surface.

Non-reciprocal circuit device and communication apparatus using the same

Disclosed herein is a non-reciprocal circuit device includes: a substrates including a magnetic plate having a circular surface and a dielectric ring having an annular surface, the circular surface and the annular surface being substantially coplanar; a center conductor disposed on the substrates; and a permanent magnet that applies a magnetic field to the center conductor. The center conductor includes: a main conductor portion positioned on a straight line extending from a center of the circular surface to an outer periphery of the annular surface; and a branched conductor portion extending in a radial direction of the substrate from the center of the circular surface. The branched conductor portion includes: a wide portion disposed on the circular surface; and a narrow portion having a width smaller than that of the wide portion and disposed across a boundary between the circular surface and the annular surface.

The object of the present invention is to provide a binder pitch increased in carbonization yield (fixed carbon content) without varying the softening point thereof. A binder pitch has a carbon-to-hydrogen molar ratio of 1.90 or more, a quinoline insoluble content of 12.0% to 30.0% by mass, a free carbon content of 12.0% to 30.0% by mass, a mesophase content of 0.50% by mass or less, a toluene insoluble content of 24.0% by mass or more, and a fixed carbon content of 58.0% by mass or more.

Binder pitch and method for producing the same

A disclosed oscillation circuit includes a constant-voltage generation circuit, an oscillation generation circuit configured to generate an oscillation output, an output circuit including a plurality of parallelly arranged MOSFET circuits, to which a constant voltage generated by the constant-voltage generation circuit is supplied as a supply voltage, output points of the plurality of MOSFET circuits being mutually connected, and a drive circuit configured to drive a selected MOSFET circuit selected in response to a selection input among the plurality of MOSFET circuits by the oscillation output, wherein an output from an unselected MOSFET circuit among the plurality of MOSFET circuits other than the selected MOSFET circuits has a high impedance.

Oscillation circuit

A function generator circuit includes a temperature detecting circuit outputting a detection voltage corresponding to an ambient temperature and having a linear temperature characteristic. Zeroth-order, first-order and second-order component generating circuits generate a zeroth-order component, a first-order component and a second-order component, respectively, of the control signal. A third-order component generating circuit generates a third-order component of the control signal based on the detection voltage. An adder-subtractor generates the control signal by obtaining a sum of the zeroth-order component, the first-order component, and the third-order component and adding or subtracting the second-order component to or from the sum. The second-order component generating circuit corrects a temperature at an inflection point of the control signal.

Function generator circuit

An oscillator circuit includes an oscillator output signal generating circuit configured to generate an oscillator output signal using an oscillator as a resonator, an amplitude detection circuit configured to detect the amplitude of the oscillator output signal and compare the detected amplitude with a threshold; and a boost circuit configured to boost the oscillator output signal according to the result of the comparison at the amplitude detection circuit. The amplitude detection circuit includes an absolute value circuit configured to obtain an absolute value signal of the oscillator output signal, a low-pass filter configured to convert the absolute value signal into a low-frequency signal, and a comparator configured to compare the low-frequency signal with the threshold.

Oscillator circuit

There is provided an electronic component excellent in moisture resistance capable of ensuring electrical connection between electrodes and hermeticity of a sealed region including a vibrating part and suppressing an increase in size. An electronic component including a piezoelectric element provided with a vibrating part and a first electrode on one face of a piezoelectric substrate and a printed circuit substrate having a second electrode is constituted by including: a bump provided in advance on one of the first electrode and the second electrode and connected to the other of the first electrode and the second electrode; an annular first metal layer surrounding the vibrating part; and a solder material with a solidus temperature lower than the bump, sealing a space between the first metal layer and the printed circuit substrate to make a placement region of the vibrating part a hermetic space, whereby moisture permeation into the hermetic space and the outward spread of the solder material can be suppressed, and a space for the bump to spread by being melted can be omitted. Moreover, the electrical connection between the electrodes and the sealing of the placement region can be performed in separate processes, so that high hermeticity can be obtained.

Electronic component and manufacturing method thereof

In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leadsare formed, wherein a chipcomprising at least one piezoelectric substrate is mounted on a resin baseinto which a lead frame is molded integrally, are provided a wire lead section metal surfacethat is formed by exposing a wire lead section, which is electrically connected with an electrode of the chip through a bonding wire, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surfacethat is formed by exposing a chip lead section, which is partially covered with the chip, from the resin base.

Surface acoustic wave device

The present invention is directed to a non-reciprocal device whose use makes it possible to reduce the insertion loss, and the size and thickness of its body, and broaden the frequency band treated by it. The DC magnetic field is adjusted such that, in a Smith chart where the center Orepresents the normalized impedance, the impedance of the gyromagnetic componentis positioned at a value which is on a constant conductance circle smaller than the reference constant conductance circle ECpassing the center Oand which is on a constant reactance line above the reference constant reactance line EXpassing the center O. Inductor Lor Lhas one end connected to a terminal of the center conductor such that in the Smith chart, the impedance of the gyromagnetic componentseen from the other end of the inductor Lor Lis positioned at a value which is on the reference constant conductance circle ECpassing the center O. First capacitor Cor Cis connected, in parallel with the center conductor, to the other end of the inductor Lor Lsuch that in the Smith chart, the impedance of the gyromagnetic componentseen through the inductor from the connection point of the first capacitor is positioned at a value which is on the center O

Non-reciprocal device

A lead frame set includes a plurality of lead frames disposed in parallel and each lead frame includes a plurality of leads. Each of the leads includes an inner lead, an intermediate portion, and an outer lead, the intermediate portions are embedded in a resin molding base, and connect the inner leads at a higher level to the outer leads at a lower level, and at least one of widths and pitches of the inner leads and the outer leads are different values.

Lead frame set and saw filter using the same

An electronic part in which a surface acoustic wave device or the like is packaged by using a resin. The electronic part has a resin base in which a lead frame and a resin are integrally molded, a surface acoustic wave device or the like mounted on the top face of the resin base, a bonding wire for connecting a lead portion on the top face of the resin base and the electronic device, and a resin cap which is bonded on the resin base so as to form a space between the resin cap and the resin base. Apart of the lead is bent along the surface of the plastic package. It is also possible to dispose the surface acoustic wave device so that its electrode pattern formation surface faces the resin base without using the bonding wire.

Growing community of inventors

Tokyo, Japan

Minoru Sakai