Mec Company Ltd.

Minoru Outani

Toshiko Nakagawa

Yoshiro Maki

Takashi Haruta

Yoshiaki Furukawa

Maki Yamanami

Sachiko Nakamura

Yoshihiro Sakamoto

Toshio Tanimura

A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium compound, and providing electroplating. The process is characterized by using an aqueous solution comprising 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, 0.01 to 10 wt % of a phosphonic group-containing amine or a salt thereof, and, optionally, 0.1 to 10 wt % of an amine other than the phosphonic group-containing amine, as a microetching agent. This process can ensure highly reliable electroplating to inner walls of printing wiring board through-holes.

Electroplating process

A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.

Composition for treating copper and copper alloy surfaces and method for

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Amagasaki, Japan

Minoru Outani