Kuraray Co., Ltd.

Hoechst Celanese Corporation

Other

Minoru Onodera

Takahiro Nakashima

Toshiaki Sato

Tatsuya Sunamoto

Takeshi Takahashi

Tadao Yoshikawa

Takeichi Tsudaka

Randy Douglas Jester

Detlef M Frank

John Arthur Penoyer

Tohei Moritani

Shuji Matsunaga

Douglas Duane Roth

Yoshinobu Tanaka

Shigeaki Suzuki

Tetsuya Hara

Shinji Hiramatsu

Toru Sanefuji

Takafumi Konno

Edwin Charles Culbertson

Sherman Hall Rounsville

Masataka Shintani

Leonard R Garrett, Deceased

Tatyuya Sunamoto

Takeichi Tsugaka

A method producing thermoplastic liquid crystal polymer (TLCP) film(s) may include (i) preparing a TLCP film (adherend film) and a TLCP film (adhesive film); (ii) examining each TLCP film for relative intensity calculated as a ratio in percentage of a sum of peak areas of C—O bond peak and COO bond peak based on the total area of C1s peaks in the X-ray photoelectron spectroscopy (XPS) profile to calculate relative intensity X (%) for the adherend film and relative intensity Y (%) for the adhesive film; and (iii) controlling the TLCP film adhesive film to have a relative intensity Y by selection or activation treatment of the adhesive film so that the relative intensity X of the adherend film and the relative intensity Y of the adhesive film satisfy38≤≤65  (1), and−8.0≤≤8.0  (2).

Methods for manufacturing thermoplastic liquid crystal polymer film and circuit board

A thermoplastic liquid crystal polymer (TLCP) molded body including a thermoplastic polymer capable of forming an optically anisotropic melt phase. The TLCP molded body includes an adherend portion in at least a part of the TLCP molded body. The adherend portion has a surface satisfying: a ratio <C—O>/<COO> of 1.5 or greater in which the <C—O> represents a proportion of a peak area of [C—O bond] to a C(1s) peak area, and the <COO> represents a proportion of a peak area of [COO bond] based on the C(1s) peak area; and a ratio <C═O>/<COO> of 0.10 or higher in which the <C═O> represents a proportion of a peak area of [C═O bond] based on the C(1s) peak area, and the <COO> represents the proportion of the peak area of the [COO bond] based on the C(1s) peak area in a result of X-ray photoelectron spectroscopy analysis.

Thermoplastic liquid crystal polymer molded body and method for manufacturing same

Provided are a metal clad laminate and a method for producing the same. The metal clad laminate at least includes a thermoplastic liquid crystal polymer film and a metal sheet bonded to each other, wherein the thermoplastic liquid crystal polymer film has a surface with a glossiness (20°) of 55 or higher in accordance with JIS Z 8741 on the opposite side of the bonding surface to the metal sheet. The method for producing a metal clad laminate at least includes: providing a thermoplastic liquid crystal polymer filmand a metal sheet; and introducing the thermoplastic liquid crystal polymer filmand the metal sheetbetween a pair of heating rolls so as to laminate them.

Metal clad laminate and production method thereof

Provided is a thermoplastic liquid crystal polymer film (TLCP film) having a dielectric constant in a thickness direction of the film, which is suitable for a millimeter-wave radar substrate. The TLCP film is a film comprising a thermoplastic polymer capable of forming an optically anisotropic melt phase, wherein the TLCP film has a dielectric constant of from 2.5 to 3.2 in the thickness direction of the film at a temperature of 23° C. and a frequency of 20 GHz, and a heat deformation temperature of from 180 to 320° C. The TLCP film has, on a film plane, dielectric constants of from 2.6 to 3.7 at a temperature of 23° C. and a frequency of 15 GHz both in one direction of the film and in a direction perpendicular to the one direction of the film.

Thermoplastic liquid crystal polymer film and circuit board using same

A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1&#xb0; C. inclusive and 50&#xb0; C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

Metal-clad laminate sheet manufacturing method, and metal-clad laminate sheet using the same

Provided is a method for producing a metal-clad laminate of a thermoplastic liquid crystal polymer film (TLCP film) and a metal sheet(s) bonded to at least one surface of the film using roll-to-roll processing. The metal sheet has a surface with a ten-point average roughness (Rz) of 5.0 &#x3bc;m or less to be bonded to the TLCP film. The method includes preparing the laminate, dry-treating the laminate by subjecting the laminate passed through a dry zone satisfying the following conditions (1) and (2): heat-treating the dried laminate by subjecting the laminate passed through a heating zone on a temperature condition of not lower than the melting point of the TLCP film successively after the dry treatment.

Method for producing metal-clad laminate, and metal-clad laminate

Provided are a thermoplastic liquid crystal polymer film having an improved thermo-adhesive property, a circuit board, and methods respectively for producing the same. The thermoplastic liquid crystal polymer film has a segment orientation ratio SOR of 0.8 to 1.4 and a moisture content of 300 ppm or less. The circuit board contains a plurality of circuit board materials wherein the circuit board materials are at least one member selected from the group consisting of an insulating substrate having a conductor layer on at least one surface, a bonding sheet, and a coverlay. At least one of the circuit board materials includes a thermoplastic liquid crystal polymer film. The circuit board shows a solder heat resistance when the circuit board is placed in a solder bath at 290&#xb0; C. for 60 seconds in accordance with JIS C 5012.

Thermoplastic liquid crystal polymer film, circuit board, and methods respectively for manufacturing said film and said circuit board

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

Circuit board and method for manufacturing same

To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (&#x2208;) of the film after heating to a dielectric constant (&#x2208;) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30&#xb0; C. lower than a melting point of the film to a temperature being 10&#xb0; C. higher than the melting point,|&#x2208;&#x2212;&#x2208;|/&#x2208;&#xd7;100&#x2266;5&#x2003;&#x2003;(I)

Thermoplastic liquid crystal polymer film, and laminate and circuit board using same

A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad, and the first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

A metal-clad laminate excellent in isotropy, appearance, bondability between a TLC polymer film and a metallic sheet, and dimensional stability is provided less costly with a first step of thermally compressing the film with the metallic sheet by passing them through a nipping region between heating rolls, and a second step of heat-treating the resultant metal-clad laminate at a temperature not higher than the melting point of the film, wherein the film has thermal expansion coefficient &#x3b1;satisfying &#x3b1;=&#x3b2;T+&#x3b3; with thickness T, thickness coefficient &#x3b2; and anisotropy coefficient &#x3b3; of the film; wherein the coefficient &#x3b2; is within the range of &#x2212;0.08 to &#x2212;0.01; the coefficient &#x3b3; is within the range of &#x3b1;+6&#x2266;&#x3b3;&#x2266;&#x3b1;+10 with thermal expansion coefficient &#x3b1;of the metallic sheet; and thermal expansion coefficient &#x3b1;of the film is within &#x3b1;&#x2212;2&#x2266;&#x3b1;&#x2266;&#x3b1;+3 with the coefficient &#x3b1;.

Metal-clad laminate and method for production thereof

The object of the invention is to provide a wiring board having the uniform quality at a high yield which is produced by hot-pressing and laminating on a wiring board base material a thermotropic liquid crystal polymer which is excellent as a wiring board covering material. The present invention provides a method of making a wiring board comprising: hot-pressing and laminating a thermotropic liquid crystal polymer film on a wiring board base material on the surface of which at least one layer containing a electro-conductive circuit is exposed, characterized by that a viscoelastic characteristic of the thermotropic liquid crystal polymer film is measured at a low frequency within a laminating temperature region and the hot-pressing is carried out at a temperature selected so that the viscoelastic characteristic falls within a predetermined range.

Method of making wiring boards covered by thermotropic liquid crystal polymer film

A method of making a thermotropic liquid crystal polymer film includes continuously heat treating of the thermotropic liquid crystal polymer filmwhile the latter is jointed to a sheet-like support member, and subsequently separating the heat-treated thermotropic liquid crystal polymer filmfrom the support member. The continuous heat treatment of the thermotropic liquid crystal polymer filmthen jointed to the support memberis carried out for a predetermined heating time within the range of 5 to 60 seconds at a predetermined heating temperature T&#xb0; C. equal to or higher than the melting point Tm&#xb0; C. of the thermotropic liquid crystal polymer film less 15&#xb0; C. (i.e., Tm&#x2212;15&#xb0; C.), but lower than the melting point Tm&#xb0; C. (thus, Tm&#x2212;15&#xb0; C.&#x2266;T&#xb0; C.&#x3c;Tm&#xb0; C.), to thereby increase the thermal expansion coefficient of the thermotropic liquid crystal polymer film.

Method of making liquid crystal polymer films

To continuously produce a metal laminate having excellent dimensional stability and flatness, there is provided with a method of producing a metal laminate in which a thermoplastic liquid crystal polymer film (') capable of forming an optically anisotropic melt phase is heat-treated on a heat treatment roll having unevenness () on its surface and subsequently a metal sheet () is bonded to at least one side of the film (&#x2032;).

Growing community of inventors

Kurashiki, Japan

Minoru Onodera