Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Minoru Omori

Tsuyoshi Yoshino

Yoshitsugu Uenishi

Yoji Masuda

Masakuni Ogino

Osamu Tomita

Nario Kawakita

Kazuo Kawahito

Katsuhisa Ishizaki

Masato Ozawa

Tsuneshi Nakamura

Yoshihiro Higuchi

Yoshiro Maruhashi

Masashi Kadoya

Cathode electrode partof flat plate-like elementis joined with cathode com terminalwith a conductive adhesive or the like. Element mounting partof anode terminalis provided with a pair of joint partsfor wrapping anode electrode partfrom both sides. The tips of joint partsand anode electrode partare joined by laser welding such that the ratio (w/d) of the width (w) of each tip of joint partsand the diameter (d) of the welding trace to be welded is 0.5 to 1.5, and more preferably, 0.5 to 1.25 for providing low ESR means for concentrating the quantity of heat at the time of welding on welding partswithout escape. Therefore, a stable welded state is obtained, so that the ESR is improved for achieving low ESR of the solid capacitor.

Solid electrolytic capacitor

A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof. The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

Method of and apparatus for manufacturing tantalum solid electrolytic capacitors

A solid electrolytic capacitor having excellent solder wettability and heat resisting adhesion and a method of manufacturing same are obtained by a simple plating configuration. The capacitor includes a capacitor element, positive electrode terminal and negative electrode terminal. The positive electrode terminal and the negative electrode terminal include a metallic member containing (i) at least one selected from the group consisting of nickel, nickel alloy, copper and copper alloy, (ii) a first plated layer of tin or tin alloy, directly disposed without undercoat on the metallic member, and (iii) an intermetallic compound layer formed between the metallic member and the first plated layer. The intermetallic compound layer contains tin-nickel or tin-copper formed through heat reflow treatment of the metallic member disposed on the first plated layer.

Solid electrolytic capacitor and method of manufacturing same

A length of metallic lead from having anode terminals and cathode terminals integrally formed with each other extends between upper and lower molds of an apparatus for manufacturing tantalum solid electrolytic capacitors. The cathode terminals are first coated with a thermosetting conductive adhesive, and cathode layers of capacitor elements are then placed on the conductive adhesive. Thereafter, anode leads extending outwardly from the capacitor elements are placed on the anode terminals are joined thereto, respectively, by welding. A pressure is applied to the capacitor elements so that a portion of the conductive adhesive is squeezed out from one surface of each of the plurality of capacitor elements to a neighboring side surface thereof The cathode terminals are then joined to the capacitor elements, respectively, by heat-curing the conductive adhesive, and the capacitor elements are finally covered with a sheathing resin.

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Kyoto, Japan

Minoru Omori