Denki Kagaku Kogyo Kabushiki Kaisha

Minoru Oda

Takeshi Miyakawa

Masafumi Hiura

Mikio Shimizu

Katsuhisa Ogita

Tetsuo Fujimura

Yuichi Kadoya

An electroconductive resin composition useful for packaging an electronic device, is provided, whereby a drawback that carbon black is likely to fall off from the surface of a molded product by abrasion, has been overcome. It is an electroconductive resin composition which comprises at least one thermoplastic resin selected from the group consisting of a polyphenylene ether resin, a polystyrenic resin and an ABS resin, and carbon black and which contains a styrene/butadiene/butylene/styrene block copolymer or a mixture of such a copolymer with an olefinic resin, and has a surface resistivity of from 10to 10&#x3a9;. Contamination of IC, etc., to be caused by falling off of carbon black, etc. by abrasion when contacted with IC, etc., can be substantially reduced.

Electroconductive resin composition

A sheet excellent in mechanical performance such as folding endurance is provided. A sheet having a substrate layer using an impact-resistant styrene type resin containing 2 to 15 wt % of rubber particles having a peak at less than 2 &#x3bc;m and an impact-resistant styrene type resin containing 0.2 to 10 wt % of rubber particles having a peak at 2 &#x3bc;m or more in a distribution of volume-based particle diameters, or a sheet having a substrate layer comprising an impact-resistant styrene type resin (A) containing 10 to 15 wt % of rubber having a volume average particle diameter of from 0.5 &#x3bc;m to 1.5 &#x3bc;m and an impact-resistant styrene type resin (B) containing 5 to 10 wt % of rubber having a volume average particle diameter of from 2.0 &#x3bc;m to 3.0 &#x3bc;m wherein (A) is from 50 to 95 wt % and (B) is from 5 to 50 wt % on the basis of the total amount of both components, and a surface layer formed on at least its one surface, is provided.

Sheet

In order to prevent static electricity impairment of an electronic component, a layer at the surface of a container to be in contact with an electronic component is one having a relatively high surface resistivity, a layer having a higher electrical conductivity than that is laminated below it, and the surface resistivity of the layer at the surface is higher than that of the layer below it. It is considered that in an electronic component packaging container having such a constitution, static electricity electrified on an electronic component is gradually discharged from the electronic component to the surface of the electronic component packaging container without sudden discharge, thus preventing the static electricity impairment. The surface layer preferably comprises a material close to the electronic component in the series of frictional electrification.

Sheet and electronic component packaging container

An electronic component packaging container which comprises a multilayer polyester sheet having a base layer comprising a polyethylene terephthalate type resin and a polycarbonate type resin and a surface layer comprising a polycarbonate type resin, formed on at least one side of the base layer, wherein the base layer contains from 70 to 97 wt % of the polyethylene terephthalate type resin and from 3 to 30 wt % of the polycarbonate type resin based on the total amount of the polyethylene terephthalate type resin and the polycarbonate type resin, and the thickness of the surface layer is from 10 to 30% of the total thickness.

Growing community of inventors

Isezaki, Japan

Minoru Oda