Nitto-denko Corporation

Minoru Nakao

Hideyuki Usui

Satoshi Okuda

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &#x3bc;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &#x3bc;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &#x3bc;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more; and (D) a silicone oil having at least one amino group per molecule. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil

An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 &mgr;m or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 &mgr;m or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 &mgr;m or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.

Growing community of inventors

Osaka, Japan

Minoru Nakao