Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Minoru Matsunaga

Kazuhide Kudo

Kouhei Matsuura

Katsuji Matsuta

Keiichi Yoshinaka

Keiichi Tsuduki

Tsuyoshi Takamatsu

Masahiko Kawaguchi

Morihiro Hamano

Kenichi Ito

An inductor component comprising an element body; a coil disposed in the element body; and a first external electrode and a second external electrode disposed on the element body and electrically connected to the coil. The coil has a helical structure in which the coil is wound while proceeding along an axis such that the axis is parallel to a bottom surface of the element body and intersects with first and second side surfaces of the element body. The coil includes coil wirings laminated along the axis and wound along a plane, and a via wiring connecting the coil wirings. The first coil wiring is on a central side in the axial direction of the coil relative to the second coil wiring, and a first pad part of the first coil wiring is adjacent to a second wiring part of the second coil wiring in the axial direction.

Inductor component

A high-frequency inductor component comprises an element body; a coil within the element body and having a helical structure in which the coil is wound along an axial direction; and first and second external electrodes on the element body and electrically connected to the coil. The element body includes first and second end surfaces that face each other and a bottom surface connected between these end surfaces. The first and second external electrodes are respectively formed from the first and second end surfaces to the bottom surface. The element body includes an insulating layer of a non-magnetic material, and internal and external magnetic members containing a magnetic material. The internal magnetic member lies where the coil is present in the axial direction, and the external magnetic member lies outside of the coil in the axial direction. The inductor component has an inductance value of 100 nH or less.

High-frequency inductor component

A coil component includes a multilayer body in which a plurality of resin insulating layers are laminated in a lamination direction and coil conductive layers disposed inside the multilayer body. The plurality of resin insulating layers includes non-photosensitive first resin insulating layers and photosensitive second resin insulating layers. The multilayer body has a section where the first resin insulating layers and the second resin insulating layers are alternately laminated.

Coil component

A composite electronic component includes a main body including insulating layers, first and second input terminals, first and second output terminals, a ground terminal, first and second filters, and a resistance pattern connected between the second filter and the ground terminal. The first filter includes a first coil pattern connected between the first input terminal and the first output terminal, and a second coil pattern connected between the second input terminal and the second output terminal. The first and second coil patterns form a common mode filter. The second filter includes a third coil pattern connected between the first input terminal and the ground terminal, and a fourth coil pattern connected between the second input terminal and the ground terminal. The third and fourth coil pattern form a differential mode filter. The resistance pattern is on the insulating layer different from those of the first to fourth coil patterns.

Composite electronic component and electronic circuit

A coil component includes a first magnetic body, an insulator stacked on the first magnetic body, a second magnetic body stacked on the insulator, a coil which is disposed in the insulator and which includes at least one coil conductor layer, and an internal magnetic body disposed within the inner circumference of the coil and connected to the first magnetic body and the second magnetic body. In a cross section in a stacking direction, the width of the internal magnetic body increases continuously from the first magnetic body side toward the second magnetic body side. Also, the inner circumferential surface of an end coil conductor layer located closest to the second magnetic body faces the outer circumferential surface of the internal magnetic body and is inclined in the same direction as the outer circumferential surface of the internal magnetic body with respect to the stacking direction.

An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a plurality of first coils that are arranged inside the multilayer body in a stacking direction of the multilayer body and are electrically connected to each other; a plurality of second coils that are arranged inside the multilayer body in the stacking direction of the multilayer body and are electrically connected to each other; an inner ground electrode that is provided inside the multilayer body and is arranged between two of the first coils, which face each other in the stacking direction; and a ground terminal that is connected to the inner ground electrode.

Electronic component

An electronic component includes a body containing glass, external conductors including a first external electrode and a second external electrode each disposed on an external surface of the body, a spiral conductor within the body, and extended conductors including a first extended conductor and a second extended conductor each disposed within the body. One end portion of the spiral conductor is electrically connected to the first external electrode with the first extended conductor therebetween and another end portion is electrically connected to the second external electrode with the second extended conductor therebetween. The spiral conductor contains Ag and at least one oxide selected from the group consisting of AlO, SiO, ZnO, TiO, and ZrO, and the extended conductor contains Ag, but none of AlO, SiO, ZnO, TiO, and ZrO.

An electronic component having a multilayer body that includes a plurality of insulating layers that are stacked on top of one another; a primary coil and a secondary coil that are arranged inside the multilayer body in a stacking direction of the multilayer body; a first ground electrode and a second ground electrode that are provided in the multilayer body and between which the primary coil and the secondary coil are interposed in the stacking direction; and a ground terminal that is connected to the first ground electrode and the second ground electrode. A capacitance is generated between the first ground electrode and the primary coil or the secondary coil and a capacitance is generated between the second ground electrode and the primary coil or the secondary coil.

A coil portion providing a common mode choke coil and a protection element portion providing ESD protection elements are disposed so as to be aligned in a lamination direction of a component body. The ESD protection elements are composed of a ground electrode and discharge electrodes each located so as to be spaced apart from the ground electrode at a predetermined interval. Capacitor electrodes are provided so as to be opposed to the discharge electrodes thereby to form capacitors, and the capacitors and coil conductors of the common mode choke coil form an LC filter. Accordingly, noise removal characteristics are caused to have higher attenuation and a wider band than with a mere inductor.

Composite electronic component

An electronic component and an electronic-component production method in which the magnitude of a stray capacitance produced between adjacent outer electrodes is controllable. The electronic component includes a chip body and first to fourth outer electrodes. In the chip body, first and second coil block are sandwiched between magnetic substrates. Dielectric layers are interposed between the outer electrodes and the chip body such as to be away from exposed portions of coil patterns in the coil blocks. The dielectric layers have a width larger than a width of the outer electrodes, and a dielectric constant of the dielectric layers is set to be lower than the dielectric constant of the magnetic substrates.

Electronic component and electronic-component production method

In a manufacturing process of electronic components which include conductive patterns laminated with insulating layers provided therebetween, conductive pattern layers having conductive patterns formed at intervals therebetween along layer surfaces and insulating layers are alternately laminated to each other. The laminate is pressed by applying a force thereto in the lamination direction, followed by cutting of the laminate along cutting lines provided along boundaries between the electronic components, so that the electronic components are separated from each other. In a cutting-removal region of a mother substrate from which the electronic components are separated from each other by cutting, removal dummy patterns having a size allowing it to be disposed within the above region are formed. In the electronic component, floating dummy patterns which are not electrically connected to the conductive patterns are formed at intervals from the cutting-removal region.

Method for manufacturing electronic components, mother substrate, and electronic component

A coil component includes a first coil block and a second coil block that are sandwiched between magnetic substrates so as to form a chip body, and external electrodes that are attached to the chip body. The first coil block includes a coil body and an insulating body. The coil body includes an outer coil portion and an inner coil portion. The outer coil portion includes a first pattern group and a second pattern group, which are connected helically vertically in an alternating fashion. The inner coil portion includes a first spiral pattern and a second spiral pattern, which are connected to each other in series. In other words, low stray capacitance is achieved by the outer coil portion, while high inductance is achieved by the inner coil portion.

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Nagaokakyo, Japan

Minoru Matsunaga