Jsr Corporation

Japan Synthetic Rubber Co., Ltd.

Minoru Matsubara

Kinji Yamada

Takahiko Kurosawa

Tomotaka Shinoda

Yasutake Inoue

Kouhei Gotou

Kohei Goto

Igor Rozhanskii

Mayumi Kakuta

Toshio Omori

Satoko Hakamatsuka

Norihiko Adachi

Tohru Masukawa

Masao Kariya

Miki Fukuta

Tohru Kodama

A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

Curable resin composition cured products

Composition for film formation and film

Electronic parts and a process for manufacturing the electronic parts are provided. The electronic parts comprise an electric insulating material exhibiting a high heat resistance and low dielectric constant as a structural component. The electric insulating material is formed of a polyimide containing a recurring unit represented by the following general formula (1). ##STR1##

Electronic part and process for manufacturing the same

Curable resin composition and cured products

A process for producing cis-4,5-dihydro-4,5-dihydroxyphthalic acid which comprises producing cis-4,5-dihydro-4,5-dihydroxyphthalic acid and/or a salt thereof from phthalic acid and/or a salt thereof using a microorganism whose activity to decompose cis-4,5-dihydro-4,5-dihydroxyphthalic acid and/or a salt thereof has disappeared or diminished, acidifying the product system unless it is acidic, and then extracting therefrom cis-4,5-dihydro-4,5-dihydroxyphthalic acid with such an organic solvent that it is miscible with water in any proportion and the mixture of the organic solvent with water can be separated into two layers upon adding a salt thereto, in the presence of a salt, or with an alcohol having 4 carbon atoms. The process enables one to produce cis-4,5-dihydro-4,5-dihydroxyphthalic acid from phthalic acid and/or its salt in a high yield.

Process for producing cis-4,5-dihydro-4,5-dihydroxyphthalic acid

Growing community of inventors

Tsukuba, Japan

Minoru Matsubara