Murata Manufacturing Co., Ltd.

Minoru Komiyama

Yoshihito Otsubo

Tadashi Nomura

Akio Katsube

Motohiko Kusunoki

Yuta Morimoto

Mitsuo Ishido

A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, and the first shield film. A stack including the resin film and the first shield film has a first opening. A first columnar conductor is disposed to be electrically connected to the first surface through the first sealing resin and the first opening. The first shield film is electrically connected to the first columnar conductor in the first opening.

Module

A module includes a substrate having a first surface, a first component and a second component that are mounted on the first surface, a first conductive material mounted between the first component and the second component, a first sealing resin provided on the first surface to cover the first component, the second component, and the first conductive material, and a first shield film that covers the first sealing resin, in which the first sealing resin has a recess to expose at least a part of the first conductive material, the first shield film extends along an inner surface of the recess and is, thereby, electrically connected to the first conductive material, the first shield film is provided with an opening in the recess, a metal bump is disposed inside the recess, and the metal bump is electrically connected to the first conductive material through the opening.

A high frequency moduleincludes a wiring board, multiple componentstomounted on an upper surfaceof the wiring board, a shield componentmounted between the componentand the component, a sealing resin layerthat covers the componentstoand the shield component, and a shield filmthat covers the surface of the sealing resin layer. A recessis formed in an upper surfaceof the sealing resin layerso as to expose the shield component. The recessis formed within a region surrounded by edges of the sealing resin layerso as not to reach the side surfaces of the sealing resin layer. The shield filmfurther covers wall surfacesof the recessand part of the shield componentexposed through the recess

Growing community of inventors

Kyoto, Japan

Minoru Komiyama