Mitsubishi Denki Kabushiki Kaisha

Renesas Electronics Corporation

Kabushiki Kaisha Toyoda Jidoshokki Seisakusho

The Kansai Electric Power Co., Inc.

Electric Power Development Co., Ltd.

Shikoku Electric Power Co., Inc.

Tokiwa Seiki Co., Ltd.

Minoru Kimura

Toshihiko Akiba

Masao Odagiri

Michitada Endo

Hiroki Ito

Kenji Kamei

Hiroyuki Sasao

Shiro Yamauchi

Takashi Moriyama

Osamu Takai

Yoshio Nishimoto

Kiyoshi Hani

Suenobu Hamano

Hiroshi Suzuki

Kazuhiko Arai

Teruo Ina

Takashi Yonezawa

Masayuki Hatano

Naoaki Takeji

Etsuo Nitta

Goro Yamauchi

Katsuya Miyata

Mutsuko Hayama

Hiroshi Hishiki

Sachiyo Minoshima

Tatsushi Nakai

Hisako Kimura

Takateru Hashimoto

Hirokazu Terauchi

Hisamitsu Takahashi

In a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer, a two-step cutting technique is used for dicing. After formation of a groove in a semiconductor wafer with a tapered blade, the groove is divided with a straight blade thinner than the groove width. The multilevel interconnect layer portion is cut while being covered with a tapered face and then the wafer is separated with a thin blade which is not brought into contact with the multilevel interconnect layer portion. The wafer can thus be diced without damaging a relatively fragile low-k layer.

Semiconductor device and manufacturing method of the same

With a recent shrinking semiconductor process, insulating layers formed between interconnect layers are becoming thin. To avoid parasitic capacitance between them, materials of a low dielectric constant have been used for an insulating layer in a multilevel interconnect. Low-k materials, however, have low strength compared with the conventional insulating layers. Porous low-k materials are structurally fragile. The invention therefore provides a manufacturing method of a semiconductor device having a multilevel interconnect layer including a low-k layer. According to the method, in a two-step cutting system dicing in which after formation of a groove in a semiconductor water with a tapered blade, the groove is divided with a straight blade thinner than the groove width, the multilevel interconnect layer portion is cut while being covered with a tapered face and then the wafer is separated with a thin blade which is not brought into contact with the multilevel interconnect layer portion. The wafer can be diced without damaging a relatively fragile low-k layer.

Making a larger difference in water activity between electrodes elevates an output voltage of an electrochemical element. The electrochemical element includes a solid electrolyte membranemade of a solid electrolyte and possessing a hydrogen ion conductivity, a first electrodeformed on one side of the solid electrolyte membraneand functioning as a catalyst and possessing a hydrophilic property, and a second electrodeformed on the other side of the solid electrolyte membraneand functioning as a catalyst and possessing a water-repellent property.

Electrochemical element and electrochemical element apparatus

There are provided a parameter storage part for storing monitor point information, a locus generation part for generating motions of the support, each joint point, and the like based on the movement command, a control point speed control part for obtaining speed of the control point such as the support, each joint point, and the like, a monitor point speed control part for obtaining speed of the monitor point generated from motion speed of the control point, and a motion command part for selecting the maximum speed among the speed of the control point and the speed of the monitor point to compare the maximum speed with the command speed and changing and controlling the speed of the control point to the command speed when the maximum speed exceeds the command speed.

Robot control apparatus

A DC circuit breaking device is provided for interrupting the transmission of direct currents to an electric power system by making external changes to an arc generated upon contacting or separation of contacts 11 and 12 in order to rapidly extend and vibrate arc currents. In a self-excited commuting DC circuit breaking device, coils 41 and 42 opposed to a fixed and a movable contact 11 and 12, respectively, are disposed around the outer circumferences of the contacts 11 and 12, and currents flowing through a commutation circuit or the contacts 11 and 12 are allowed to flow through the opposed coils 41 and 42 so as to apply magnetic fields to the neighborhood of an arc. This constitution provides the DC circuit breaking device with high performance that it can rapidly extend and vibrate arc currents to thereby interrupt direct currents.

DC circuit breaking device

A pipe joint can be attached to a hydraulic apparatus so as to be able to absorb vibrations of a pipe or the like connected to thereto. The pipe joint comprises a joint member having one end provided with an externally threaded portion in which external threads are cut, an annular clearance groove and an O ring squeezing surface, and an intermediate member to be fixedly screwed in the hydraulic apparatus, provided with an internally threaded portion in which internal threads are cut and an annular clearance groove. When the externally threaded portion of the joint member is screwed completely in the intermediate member, the externally threaded portion of the joint member drops into the annular clearance groove of the intermediate member, and the internally threaded portion of the intermediate member drops into the annular clearance groove of the joint member, so that the joint member is able to turn relative to the intermediate member.

Pipe joint for hydraulic pipe

Method of printed circuit board manufacture, and resulting board. A plurality of prepreg sheets composed of ceramic paper and containing different quantities of a resin are laid on each side of a core metal sheet having a through hole. A copper foil is laid on the prepreg sheets on each side of the core. All of the layers are pressed together under heat to make a metal-core printed wiring board. The prepreg sheets form an insulating layer having a high heat-dissipating capacity on each side of the core and a reliable insulator in its through hole. The ceramic paper consists essentially of short ceramic fibers having a diameter not exceeding fiber microns and a length of 5 to 500 microns, and contains 3 to 10% by weight of microfibrillated cellulose fibers as a binder for the ceramic fibers.

Metal-core printed wiring board and a process for manufacture thereof

An evaporation-cooled gas insulated electrical apparatus comprising, in a housing, an electrical device generating heat when in operation, a condensable refrigerant convertible between liquid and vapor phases, and a noncondensable, electrically insulating gas. The condensable refrigerant and the noncondensable gas are selected so that the ratio V.sub.g /V.sub.1 of the gas phase volume V.sub.g and the liquid phase volume V.sub.1 is between 1 and 10, and so that the specific weight of the noncondensable gas is smaller than the specific weight of the vapor of the condensable refrigerant during operation, and so that the noncondensable gas and the condensable refrigerant vapor are separated due to the difference in their specific weights. The noncondensable gas is a mixture of two noncondensable gases, one of the mixed gases having a very small solubility into the condensable refrigerant compared to that of the other mixed gas, and the condensable refrigerant is a fluorocarbon liquid having a boiling point between 80.degree. C. and 160.degree. C. and a mean molecular weight of between 180 and 700.

Evaporation-cooled gas insulated electrical apparatus

A plurality of upstanding cooling ducts in a condenser are closed at their upper ends and only a lower header which is disposed at the lower ends of the cooling ducts communicates a tank with the cooling ducts. In another embodiment, a check valve and a gas pump are disposed in an upper conduit connecting the tank to a common upper header communicating the cooling ducts with each other at their upper ends so as to discharge the noncondensable gas from the condenser to the tank. Further, a sensing device may be disposed to sense the interface between the noncondensable gas and the vapor refrigerant in the cooling ducts, and a controller may be disposed to compare the interface level sensed by the sensing device with a reference interface level set in the controller to control the gas pump such that the actual interface level is in conformity with the reference interface level.

Evaporation cooled gas insulated electrical apparatus

An ebullition cooled transformer has a housing, a core and coil assembly disposed on the lower portion of the housing to be immersed into a condensible electrically insulating refrigerant, a cooler unit located above the core and coil assembly within the housing, and a communicating tube disposed at the top of the housing to communicate with the outside air and provided with a porous filter permitting the air to permeate it but preventing a vapor of the refrigerant from permeating it.

Ebullition cooled transformer

An electrostatic shield for an electrical transformer comprises a substantially ring-shaped inner insulator of asymmetric vertical cross-section with a side confronting a coil of the transformer being substantially planar and the remaining surface being of a curved section, a field concentration relaxation conductor formed from a conductive foil, completely surrounding the inner insulator, and a multiple outer insulator comprising at least one layer of polyethylene terephthalate (PET) film and at least one mica insulation layer with mica bonded to a non-conductive backing film such as glass tape or PET film by a bonding agent such as epoxy resin, whereby the dielectric strength of the electrostatic shield and hence the transformer, is substantially improved.

Electrostatic shield for a transformer

Growing community of inventors

Tokyo, Japan

Minoru Kimura