Kabushiki Kaisha Shinkawa

Minoru Kawagishi

Mitsuaki Sakakura

Tadashi Akiike

Nobuto Yamazaki

Ryuichi Kyomasu

Mitsuru Kagamihara

An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.

Capillary holding structure for ultrasonic horn

An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions. In addition, a tightening member, such as a nut, is screwed on the external screw section so that a ring-form pressing part which is formed on the tightening member presses only against the vertically opposing end portions of the spacer, thus holding the capillary on the horn.

Capillary holding structure for an ultrasonic horn

An ultrasonic horn of a bonding apparatus quipped with a bonding tool attached to one end of the horn and a vibration-generating source such as an electrostrictive strain element, magnetostrictor, etc. attached to a bonding arm that supports the bonding horn. The ultrasonic horn is further provided with a vertical vibration adjuster which adjusts the vertical component of the vibration of the ultrasonic horn, and the vertical vibration adjuster includes a projection, recess, etc. provided at the end of the horn.

Bonding apparatus

A bonding apparatus used in manufacturing semiconductor devices, etc. including an ultrasonic horn mounted to a bonding arm of the bonding apparatus via a horn support. The ultrasonic horn is provided with a bonding tool at one end and a vibration-generating source at another end, and respective values of vibrational wavelengths on both sides of the horn support are set so that the value on the bonding tool side of the horn support is 7 or greater relative to a value of 3 on the opposite side of the horn support from the capillary. In other words, the distance from the horn support to the end of the vibration-generating source is set to be 1/4 of the wavelength, and the distance from the horn support to the end of the horn where the bonding tool is attached is set to be 3/4 of the wavelength.

A paste-dispensing apparatus for bonding machines, etc., which constantly dispenses a fixed amount of paste, glue, etc. regardless of the amount remaining in a syringe and detects the amount of paste remaining in the syringe, including an air supply which supplies air under positive pressure to the syringe, a dispensing valve installed between the syringe and the air supply and connected to the syringe via a first pipe and to the air supply via a second pipe so that the syringe and the air supply communicate with each other when the paste is discharged, a first pressure sensor which measures the pressure inside the first pipe, a second pressure sensor which measures the pressure inside the second pipe, and a controller. Pressure values measured by the first and second pressure sensors are supplied to the controller so that the controller outputs a signal which actuates the dispensing valve so that the first and second pipes communiate when the paste is discharged. The controller further controls the time for outputting the signal in accordance with the difference in the time required for the pressure measured by the first pressure sensor to reach a preset pressure level after the first and second pipes have communicated with each other.

Dispensing apparatus

A die bonding apparatus including a vertically moving block, a collet holder provided on the vertically moving block such that the collet holder itself freely moves up and down, a collet which holds a die to be bonded to a substrate and is installed in the collet holder, a first contact provided on the vertically moving block, and a second contact provided on the collet holder so that the second contact is pressed by a spring to make contact with the upper surface of the first contact. The position where rapid downward movement of the collet is stopped and the bonding load applied to the substrate are decided based upon a signal which is generated upon separation of the two contacts.

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Tokyo, Japan

Minoru Kawagishi