Showa Denko Materials Co., Ltd.

Resonac Corporation

Hitachi Chemical Company, Ltd.

Minoru Kakitani

Takao Tanigawa

Hiroshi Shimizu

Keisuke Kushida

Shinichi Kamoshida

Yasuyuki Hirai

Yoshiyuki Takeda

Tetsuroh Irino

Norihiro Abe

Kouji Morita

Chihiro Hayashi

Ryuji Akebi

Yoshikatsu Shiraokawa

Kenichi Oohori

Tatsunori Kaneko

Hikari Murai

Tomio Fukuda

Ken Nanaumi

Teruki Aizawa

Yoshihiro Nakamura

Tomokazu Shimada

Makoto Yanagida

Syunichi Numata

Kenichi Tomioka

Yuya Hirayama

Kazutoshi Danjoubara

Kosuke Murai

Hironori Suzuki

Takayo Kitajima

Mami Shimada

Shuji Gozu

Shunsuke Tonouchi

Akira Horie

Provided are a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof, (B) a modified conjugated diene polymer, and (C) a thermoplastic elastomer other than the above component (B), wherein the component (B) is one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups; and a prepreg, a resin film, a laminated board, a printed wiring board and a semiconductor package, each using the maleimide resin composition.

Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package

The present invention relates to a maleimide resin composition containing (A) one or more selected from the group consisting of a maleimide compound having one or more N-substituted maleimide groups and a derivative thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in a main chain thereof, wherein the component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package that are obtained by using the maleimide resin composition.

Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

The present disclosure relates to a fluororesin substrate laminate for a high-frequency circuit, the fluororesin substrate laminate including a fluororesin substrate and an adhesive layer provided on the fluororesin substrate, wherein the adhesive layer includes a resin composition containing: (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group; and (B) an aromatic maleimide compound.

Fluororesin substrate laminate

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 &#x3bc;m or less.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Resin composition, laminate sheet, and multilayer printed wiring board

The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.

Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.

Resin varnish, prepreg, laminate, and printed wiring board

The present invention relates to a resin composition containing (A) a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group and (B) a halogen-free flame retardant.

Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar

A thermosetting resin composition containing: (A) an addition reaction product of a maleimide compound having at least two N-substituted maleimide groups in one molecule (a1) and an amine compound having at least two primary amino groups in one molecule (a2), (B) a thermoplastic elastomer, and (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a carboxylic acid anhydride.

Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module

The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin

The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50&deg; C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

Resin composition, and use and method for preparing the same

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Tokyo, Japan

Minoru Kakitani