Dow Corning Toray Silicone Company Limited

Dow Corning Toray Company, Ltd.

Kaneka Corporation

Minoru Isshiki

Kimio Yamakawa

Katsutoshi Mine

Yoshiko Otani

Yoshitsugu Morita

Tomoko Kato

Takeyuki Suzuki

Hiroshi Ueki

Ryoto Shima

Toshio Okuhara

Tadashi Tadokoro

Kazumi Nakayoshi

Hiroki Ishikawa

Junji Nakanishi

Hiroaki Shiota

Hiroji Enami

Yoshito Ushio

Atsushi Togashi

A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R&#x2014;(RSiO)RSi&#x2014;R-A, wherein Ris substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, Ris a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.

Curable silicone composition and electronic components

A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (RSiO)(RSiO)(RSiO)(SiO)(wherein R, R, and Rare each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of Rare aryl groups, and a, b, c, and d are numbers that satisfy 0&#x2266;a&#x2266;0.8, 0&#x2266;b&#x2266;0.8, 0.2&#x2266;c&#x2266;0.9, 0&#x2266;d&#x3c;0.8, and a+b+c+d=1), and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a compound that has a group capable of reacting with the epoxy group; (C) a cure accelerator; and (D) a thermally conductive filler, has excellent handling characteristics and that cures rapidly to give a cured product that is highly thermally conductive, very flexible, highly adhesive, and very flame retardant.

Curable silicone composition and cured product therefrom

A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.

Curable silicone composition and electronic component

A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

Curing silicone composition and cured product thereof

A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO)[RSiO](where R represents a cycloalkyl group, and Rrepresents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one Rin one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0&#x3c;a&#x2266;3; x&#x3e;0; y&#x3e;0; and x+y=1).

Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane

A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [RSiO][RSiO][RSiO](where R, R, and Rare univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of Rare aryl groups; a+b+c equals 1; on average, 'a' satisfies the following condition: 0&#x2266;a&#x2266;0.8; on average, 'b' satisfies the following condition: 0.2&#x2266;b&#x2266;0.8; and, on average, &#x201c;c&#x201d; satisfies the following condition: 0.2&#x3c;c&#x3c;1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Curable silicone composition and cured product thereof

A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor device

A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.

Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device

An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

Adhesive and semiconductor devices

An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1&times;10 Pa at &minus;65&deg; C. and a shear frequency of 10 Hz.

Semiconductor device having an adhesive and a sealant

Silicone-based adhesive sheet method for manufacturing same and semiconductor device

A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule &lcub;alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)&rcub;; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned composition

A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.

Growing community of inventors

Chiba Prefecture, Japan

Minoru Isshiki