Fujitsu Corporation

Minoru Ishinabe

Kazushi Uno

Fumio Takei

Takeo Kasajima

Hiroyuki Fukuda

Satoshi Inano

Kyoko Tadaki

Yukiko Wakino

Hiroki Uchida

Hiroaki Date

Hideshi Tokuhira

Masanobu Ishiduka

Jun Taniguchi

Hiroyoshi Kodama

Wataru Tanaka

Takahiro Kashikawa

Masatomo Asano

Nobuhiro Nanri

Kyouko Tadaki

A cooling system includes: a cooling device; a pump coupled to the cooling device; and a waste heat device coupled to the cooling device, wherein the cooling device includes: a first refrigerant tank and a second refrigerant tank that each stores a first refrigerant that is output from the waste heat device and input to the waste heat device; and a liquid immersion tank sandwiched between the first refrigerant tank and the second refrigerant tank and configured to hold an electronic device in a second refrigerant that is output from the pump and input to the pump.

Cooling system, cooling device, and electronic system

A liquid immersion tank includes a first tank configured to store coolant to cool an electronic device provided in the first tank, a first plate horizontally disposed below the electronic device and configured to include straightening holes that penetrate through the first plate in a vertical-direction, and a second plate disposed below the first plate and configured to be movable from an overlap position overlapped by the first plate to a spaced position where the second plate is disposed below the first plate and spaced from the first plate, the second plate including flow adjusting holes that are formed at positions respectively aligned with the straightening holes and that penetrate through the second plate in the vertical-direction, wherein, in a region where the first plate overlaps the second plate, a total opening area of the flow adjusting holes is smaller than a total opening area of the straightening holes.

Liquid immersion tank and electronic apparatus

An apparatus for liquid immersion cooling, the apparatus includes: a casing configured to be partly filled with a first coolant and immerse, in the first coolant, a heat generating component other than a first heat generating component in a plurality of heat generating component; a liquid cooling jacket provided in contact with the first heat generating component placed in the casing, and configured to cool the first heat generating component; a first cooling device configured to dissipate heat of a second coolant sent out from the liquid cooling jacket through a first pipe, thereby cooling the second coolant; and a first pump configured to send out the second coolant cooled by the first cooling device to the liquid cooling jacket through a second pipe.

Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device

An apparatus includes: a cooling medium bath configured to house a first refrigerant in which an electronic device is immersed; a liquid-cooling jacket configured to be provided to the electronic device and to cool the electronic device by a second refrigerant that flows in an internal section of the liquid-cooling jacket; a first pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to supply the second refrigerant from an outside of the cooling medium bath to the liquid-cooling jacket; a second pipe coupled to the cooling medium bath, to be immersed in the first refrigerant, and configured to discharge the second refrigerant that flows in the internal section of the liquid-cooling jacket to the outside of the cooling medium bath; and a circulator configured to cause the first refrigerant in the cooling medium bath to stream.

Liquid cooling device, liquid cooling system, and control method of liquid cooling device

A cooling device includes, a liquid immersion tank having an opening in a top thereof, in which an electronic circuitry including a heat generating circuit is immersed in a second coolant, a lid fitted into the opening, and a cooler, into which a cooled first coolant is input through a first pipe, and from which the first coolant is output through a second pipe, the cooler being located between a liquid level of the second coolant and a lower surface of the lid that faces the liquid level.

Cooling device, cooling system, and cooling method for electronic circuitry

A liquid immersion tank includes an outer-case to have a first hole in a side-wall of the outer-case and an opening at a top of the outer-case, an inner-case to have a second hole in a side-wall of the inner-case and an opening at a top of the inner-case, the inner-case being contained in the outer-case and containing an electronic device to be cooled by a coolant, and a spring to support the inner-case to be able to move between a first position and a second position disposed above the first position, cause, when the inner-case is at the first position, the second hole to communicate with the first hole so that the coolant flow into the inner-case, and cause, when the inner-case is at the second position, the second hole to face the side-wall of the outer-case so that the coolant is prevented to flow into the inner-case.

Liquid immersion tank

A liquid immersion server includes a processor, a heat sink to which heat generated by the processor is transferred, a flow channel through which a first refrigerant liquid that has absorbed heat from the heat sink flows, and a cooling bath that stores a second refrigerant liquid that is inactive in a lower section thereof and that stores the first refrigerant liquid in an upper section thereof, wherein when the liquid immersion server is in operation, the processor, the heat sink, and the flow channel are immersed in the second refrigerant liquid, the flow channel has a supply port to which the first refrigerant liquid is supplied from a first pipe and a first discharge port that discharges the first refrigerant liquid that has absorbed heat into the cooling bath.

Liquid immersion server

An immersion cooling apparatus includes an immersion tank in which an electronic device is disposed and in which a secondary refrigerant is stored, the electronic device being dipped into and cooled down by the secondary refrigerant, a housing in which the immersion tank is disposed and in which a primary refrigerant is stored, the immersion tank being dipped into and cooled down by the primary refrigerant, and a driver that rotates the immersion tank, wherein the immersion tank being rotatably attached to an interior of the housing, the immersion tank having an inner circumferential surface and an outer circumferential surface, the inner circumferential surface being positioned facing the electronic device, the outer circumferential surface being positioned on an opposite side of the inner circumferential surface, each of the inner circumferential surface and the outer circumferential surface having a plurality of projections.

Immersion cooling apparatus

An information processing system includes a chiller configured to cool a primary refrigerant; a liquid immersion tank in which a processing device including a first electronic component is immersed in a secondary refrigerant; a second electronic component coupled to the processing device; a blower configured to blow or inhale air for the second electronic component; a coil in which the secondary refrigerant is cooled by the air; an air tank that is coupled to the coil and that includes a refrigerant pipe through which the secondary refrigerant flows; a heat exchanger configured to exchange heat between the primary refrigerant and the secondary refrigerant; and a pump configured to circulate the secondary refrigerant from the liquid immersion tank to the heat exchanger.

Information processing system and control method for information processing system

An abnormality detection system includes an optical fiber, a Raman scattered light detection unit, and a data processing unit. The detection unit is configured to detect Stokes light and anti-Stokes light which are generated in the optical fiber and to output data on the intensity distribution of the Stokes light in the optical fiber in the length direction thereof and data on the intensity distribution of the anti-Stokes light in the optical fiber in the length direction. The processing unit is configured to calculate the product of a value obtained by applying an FIR filter to the intensity distribution of the Stokes light, and a value obtained by applying the FIR filter to the intensity distribution of the anti-Stokes light for each of locations on the optical fiber in the length direction, and to determine whether or not abnormality is present based on the result of the calculation.

Abnormality detection system and abnormality detection method

A temperature measurement system includes an optical fiber, a temperature distribution measurement apparatus, and a data processing apparatus. The temperature distribution measurement apparatus is configured to detect backscattered light by causing light to enter the optical fiber, and acquire the temperature distribution of the optical fiber in the length direction thereof based on the result of the detection. The data processing apparatus is configured to store therein the temperature distribution acquired by the temperature distribution measurement apparatus, perform signal processing on a difference temperature distribution obtained by computing the difference between a current temperature distribution and a past temperature distribution, and determine whether or not abnormality is present based on the result of the signal processing.

Temperature measurement system and abnormality detection method

A temperature distribution measurement apparatus includes a laser light source optically connected to an optical fiber, a photodetector configured to detect light backscattered in the optical fiber, and a temperature distribution measurement unit configured to obtain a true measured temperature distribution by performing correction calculation using a transfer function on a temporary measured temperature distribution obtained based on an output from the photodetector. The temperature distribution measurement unit stores therein data on a transfer function set for each entire length of the optical fiber and for each longitudinal position in the optical fiber. Then, when the length of the optical fiber is changed, the temperature distribution measurement unit changes the transfer function to be used in the correction calculation by using the data on the transfer function.

Temperature distribution measurement apparatus and temperature distribution measurement method

An abnormality detection system includes an optical fiber, a backscattered light detection unit, and a data processing unit. The detection unit is connected to one end and the other end of the optical fiber and configured to acquire a first intensity distribution of backscattered light by causing light to enter the optical fiber from the one end, and to acquire a second intensity distribution of backscattered light by causing light to enter the optical fiber from the other end. The processing unit is configured to calculate the product of a value obtained by applying a first FIR filter to the first intensity distribution, and a value obtained by applying a second FIR filter to the second intensity distribution, for each of locations on the optical fiber in the length direction thereof, and to determine whether or not abnormality is present based on the result of the calculation.

A temperature distribution measurement system includes an optical fiber, a laser light source optically connected to the optical fiber, a photodetector configured to detect light backscattered in the optical fiber, and a temperature distribution measurement unit configured to perform correction calculation using a transfer function on a measured temperature distribution obtained from an output from the photodetector. The temperature distribution measurement unit acquires an actual temperature distribution in a location where the optical fiber is laid and determines appropriateness of the transfer function by computing a difference between the measured temperature distribution after the correction and the actual temperature distribution.

Growing community of inventors

Atsugi, Japan

Minoru Ishinabe