Daishinku Corporation

Neomax Co., Ltd.

Neomax Materials Co., Ltd.

Minoru Iizuka

Takuya Kojo

Yoshikiyo Ogasawara

Masaaki Ishio

Kazuhiro Shiomi

Tatsuya Murakami

Hiroyuki Ishihara

Syunsuke Satoh

Tomo Fujii

Yoshinari Morimoto

Takashi Shirai

Kentaro Nakanishi

Kozo Shibutani

Koichi Kishimoto

Yuka Kojo

Takashi Nakamura

Susumu Hirao

Akihiro Mori

Kazuhiko Kumatani

Yoshihisa Takano

Naotoshi Nakamura

Mototsugu Ogasa

An oven-controlled crystal oscillator according to one or more embodiments may include a core section having a crystal resonator, an oscillator IC and a heating IC, wherein the core section is supported by a package via an interposer, and furthermore the core section is hermetically encapsulated in the package.

Oven-controlled crystal oscillator

A piezoelectric resonator device having a sandwich structure is provided, which can avoid gas generation with reduced size or height. A crystal resonator includes a crystal resonator plate, a first sealing member and a second sealing member. A sealing-member-side first bonding pattern and a sealing-member-side second bonding pattern, both to be bonded to the crystal resonator plate, are formed respectively on the first and second sealing members. On the crystal resonator plate, a resonator-plate-side first bonding pattern to be bonded to the first sealing member is formed on a first main surface and a resonator-plate-side second bonding pattern to be bonded to the second sealing member is formed on a second main surface. The sealing-member-side first bonding pattern is bonded to the resonator-plate-side first bonding pattern, and the sealing-member-side second bonding pattern is bonded to the resonator-plate-side second bonding pattern, both by diffusion bonding.

Piezoelectric resonator device

A crystal resonator includes: a crystal resonator plate; a first sealing member that covers a first excitation electrode of the crystal resonator plate; and a second sealing member that covers a second excitation electrode of the crystal resonator plate and includes a first external electrode terminal and a second external electrode terminal to be bonded to a circuit board using a flowable conductive bonding material. The second sealing member includes a second through hole and a third through hole that pass through between a first main surface and a second main surface on which the first external electrode terminal and the second external electrode terminal are formed. The second through hole and the third through hole include: respective through electrodes for conduction between electrodes formed on the first main surface and the second main surface; and respective through parts.

Piezoelectric resonator device, and bonding structure of piezoelectric resonator device and circuit board

Piezoelectric vibration device

A base of a surface-mount electronic component package holds an electronic component element and is to be mounted on a circuit board with a conductive bonding material. The base has a principal surface and an external connection terminal to be electrically connected to the circuit board. The external connection terminal is formed in the principal surface. The base includes a bump formed on the external connection terminal. The bump is smaller than the external connection terminal. The base has a distance d between an outer periphery end edge of the external connection terminal and an outer periphery end edge of the bump along an attenuating direction of stress on the external connection terminal The stress is generated in association of mounting of the base on the circuit board. The distance d is more than 0.00 mm and equal to or less than 0.45 mm.

Base of surface-mount electronic component package, and surface-mount electronic component package

An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate

There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.

Electronic component package

An electrode forming region for providing lead electrodes () is provided on a crystal resonator plate (). Opposed side surfaces () of a substrate () are formed and inclined in the same direction with respect to a front major surface (). Also, an adhesion reinforcing portion () for reinforcing adhesion to a conductive adhesive () is provided in the electrode forming region for the lead electrodes (). For example, the adhesion reinforcing portion () is a notch portion which is cut and formed in the opposed side surfaces (). Thereby, an adhesion strength of the crystal resonator plate () and the conductive adhesive () is increased.

Piezoelectric resonator plate and piezoelectric resonator device

An electronic component package includes a case having a cavity portion including an electronic component therein, and a lid member which is fusion-welded to the case via a fusion-welding layer to hermetically seal the cavity portion. The case has a first metal layer laminated on the case so as to be exposed on the open side at the cavity portion. The lid member has a core portion, and a second metal layer laminated on a side of the core portion facing the case. The fusion-welding layer has a soldering material layer formed of a soldering material, and first and second intermetallic compound layers disposed on opposite sides of the soldering material layer as a result of diffusion of a major component of the soldering material into the first metal layer and the second metal layer. The ratio of the area of the first and second intermetallic compound layers in a longitudinal section of the fusion-welding layer relative to the area of the longitudinal section of the fusion-welding layer is in a range of from about 25% to about 98%. This package maintains superior airtightness even when exposed to a high-temperature atmosphere, which is higher than the melting point of the soldering material.

Electronic component package and method of manufacturing same

A quartz oscillator device of the present invention comprises a quartz oscillating plate having two major surfaces, each of which is formed with an excitation electrode and lead electrodes drawn out of the excitation electrode, and electrode pads formed on a base, wherein the quartz oscillating plate and the electrode pads are electrically connected via a silicone-based conductive adhesive. Among the excitation electrode and the lead electrodes, at least each of the lead electrodes comprises a Cr film layer, a Au film layer, and a thin Cr film layer or a thin Ag film layer, which are laminated on the quartz oscillating plate in this order. In addition, each electrode pad comprises a metallized layer made of tungsten or molybdenum, a Ni film layer and a Au film layer, which are laminated on the base in this order; and Ni in the Ni film layer is diffused at least into a predetermined area of the Au film layer in each electrode pad where the silicone-based conductive adhesive is applied.

Growing community of inventors

Kakogawa, Japan

Minoru Iizuka