Yamaichi Electronics Co., Ltd.

Minoru Hisaishi

Noriyuki Matsuoka

Takeyuki Suzuki

Yoshinori Wakabayashi

Toshitaka Kuroda

In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.

Semiconductor device carrier unit and semiconductor socket provided therewith

In a carrier unit, a posture-stabilizing memberfor stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheetis placed on the electrode sheetin a carrier unit

Carrier unit for a semiconductor device and semiconductor socket using the same

Base for a semiconductor carrier

Cover for a semiconductor carrier

Semiconductor carrier

A latch locking mechanism of a KGD carrier includes a carrier retaining member having a cover and a chip retaining member, a carrier base assembly having a carrier main body, a substrate, and a carrier base, at least two opposite latches rotationally movably provided on the cover of the carrier retaining member and each including an operation portion and a locking portion which generally form an L shape, and engaging portions provided on the carrier main body of the carrier base assembly to engage with the corresponding locking portions of the latches. When the locking portions of the two opposite latches are closed, the locking portions engage with the corresponding engaging portions provided on the carrier main body to lock the carrier retaining member and the carrier base assembly.

Latch locking mechanism of a KGD carrier

A KGD carrier holds the IC chip by means of a carrier retaining member and a carrier base assembly. The carrier base assembly includes a carrier body, a carrier base and a substrate. The carrier body is provided with grooves, which are located opposing to pads formed on a peripheral portion of the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is provided with the grooves, which are located opposing to the pads formed on the peripheral portion of the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base so as to enable the pads of the substrate and the corresponding contacts of the IC socket to be electrically connected with each other.

Growing community of inventors

Tokyo, Japan

Minoru Hisaishi