Fujitsu Corporation

Minoru Hirano

Masumi Suzuki

Akira Ueda

Shigeru Hidesawa

Toyokazu Hamaguchi

Shunichi Kikuchi

Hitoshi Nori

Ryuuji Miyazaki

Kiyotaka Seyama

Kenichi Fujii

Masuo Ohnishi

Tadashi Katsui

Hideaki Yoshimura

Junichi Ishimine

Takashi Kanda

Yoshiaki Udagawa

Akihiko Fujisaki

Keizo Takemura

Masahiro Miyo

Makoto Sumiyoshi

Masakazu Matsubara

Kohei Kida

Hiromichi Okabe

Naoki Yasuda

An information processing apparatus includes a fan that cools a first processor, a dust-proof bezel that prevents dust from entering a casing, a memory, and a second processor coupled to the memory. The second processor is configured to measure a temperature of the first processor and an air volume of an air flow which passes through the dust-proof bezel, compare a registered air volume to the measured air volume when the temperature matches a registered temperature included in comparison information stored in the memory. The registered air volume being included in the comparison information in association with the matched temperature and the comparison information including a registered temperature of the first processor and a registered air volume of an air flow generated by the fan in association with each other. The second processor determines an abnormality in the dust-proof bezel based on a comparison result.

Information processing apparatus having dust-proof bezel and information processing method using the same

A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

Cooling unit

An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.

IC card and IC card cooling tray

The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Electronic apparatus having a heat dissipation member

A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.

Method of controlling cooling device in portable electronic and cooling device therefor

It is an object of the present invention to provide a cooling system capable of simultaneously cooling the electronic parts on a multichip module that is arranged so as to provide a predetermined function, wherein the cooling system can be easily and quickly attached to and detached from the module when necessary. The present invention is to provide a cooling system for cooling a multichip module MCM having a predetermined function, on the substrate B of which a plurality of electronic parts including heat generating parts P are mounted, the cooling system for cooling a multichip module comprising: a radiating body,capable of covering upper portions of the plurality of electronic parts P while a predetermined clearance is formed between the radiating body,and the electronic parts P; a sheet S made of silicon rubber arranged in the clearance, for thermally connecting the upper surfaces of the electronic parts and the radiating member; and a screw N for detachably connecting the radiating body with the substrate B of the multichip module MCM.

Cooling system for multichip module

A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

Heat sink structure for cooling a substrate and an electronic apparatus

A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

Semiconductor element cooling apparatus

Growing community of inventors

Kawasaki, Japan

Minoru Hirano