Rohm Co., Ltd.

Minoru Hirai

Osamu Miyata

Tomoharu Horio

Shigeyuki Ueda

Osamu Tanaka

An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate ( ), an IC chip ( ) mounted on the substrate, and a protective member ( ) bonded to the substrate ( ) to cover the IC chip ( ). A clearance (S) is provided between the protective member ( ) and the IC chip ( ) for avoiding direct contact of the protective member ( ) with the IC chip ( ). The clearance (S) is loaded with a filler ( ) having a low modulus of elasticity, as required. The protective member ( ) includes a reinforcing member ( ).

Module for IC card, IC card, and method for manufacturing module for IC card

In the method of manufacturing an IC module (,) including a resin packaging process using upper and lower dies (,) for forming a cavity (,) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (,) on which an IC chip (,) is placed and a coil (,A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (,). When a substrate (,) on which an antenna coil (,) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (,) having an equal and almost equal height to the height of the cavity (,) on the substrate (,), housing it in the cavity (,), and introducing a melted resin. Instead of forming the spacer (,) on the substrate (,), a substrate (,) housed in a cavity (,) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.

IC module, method of manufacturing the same and IC card provided with IC module

A manufacturing method includes the steps of integrally fabricating a plurality of circuit elements (,) on a substrate (,), forming electrode bumps (,) on electrode pads (,) conducting with circuit elements (,), forming a scribe line or a scribe line mark (,) at a prescribed position of substrate (,), and sticking an anisotropically conductive film (,) to cover each of the electrode bumps (,) and the scribe line or the scribe line mark (,). The step of forming the electrode bumps (,) and the step of forming the scribe line or the scribe line mark (,) are performed simultaneously. The electrode bumps (,) and the scribe line or the scribe line mark (,) are preferably formed of gold. By the manufacturing method, even when an anisotropically conductive film is stuck on a semiconductor wafer having a plurality of circuit elements formed, the circuit elements can be diced as desired.

Process for manufacturing semiconductor wafer, process for manufacturing semiconductor chip, and IC card

IC module and IC card

An integrated circuit and its using method. The integrated circuit having a serial-parallel converter and a driver unit is further provided with a setting circuit which is responsive to a selection signal value for setting the number of shift stages of the serial-parallel converter. When serial data consisting of a number of bits exceeding the setup stage count is input, the serial-parallel converter outputs data as overflow serial data in order starting at the first input bit of the serial data. A plurality of the integrated circuits are cascaded so that overflow serial data output from the integrated circuit at a preceding stage is supplied to the integrated circuit at the following stage as serial data to be converted into parallel data. The same selection signal value is supplied to each of the integrated circuits.

Integrated circuit having a shift stage count changing function

A liquid crystal display device including a liquid crystal display panel having an electrode terminal, a circuit board having a driving circuit for the liquid crystal panel and a circuit terminal portion, and a connection wiring which is held in a flexible film and connects the electrode terminal with the circuit terminal portion, wherein the circuit terminal portion is located on the circuit board at a predetermined distance from a side edge of the circuit board; and the flexible film is held by a curable fixing member provided on the circuit board at a distance smaller than the predetermined distance from the side edge of the circuit board.

Liquid crystal display with flexible circuit holding driver circuit

An electronic part assembly composed of electronic parts wherein a projecting electrode formed on an electrode pad is pressed against a wiring pattern of a circuit board. A cover member a arranged so as to cover the electronic parts, and has a leg portion designed to be joined to the circuit board. A shape memory alloy member is arranged between the cover member and the electronic parts to press a reverse side surface so that electric connection between the projecting electrode and the wiring pattern can be maintained.

Electronic part assembly using a shape memory alloy element

The improved liquid-crystal display device has a slit formed in part of the TAB area where the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB and the liquid-crystal display panel is bonded to the TAB by means of a first anisotropic conductive adhesive having a comparatively weak adhesive force, such as a thermoplastic anisotropic conductive adhesive, whereas a second anisotropic conductive adhesive having a comparatively strong adhesive force, such as a uv curable adhesive, is coated in the slit. This liquid-crystal display device can be produced by a process that proceeds basically as follows: the electrodes on the liquid-crystal display panel are connected to the output terminals on the TAB by means of a thermoplastic adhesive as the first anisotropic conductive adhesive having a comparatively weak adhesive force; then, the assembly is subjected to an operating test; if the TAB is found to be defective in the operating test, it is replaced and, if no defect is found, a uv curable or a thermosetting adhesive as the second anisotropic conductive adhesive having a comparatively strong adhesive force is coated in the slit and then cured as the output terminals are compressed against the electrodes.

Method of connecting a tab film and a liquid crystal display panel

In order to electrically connect the projecting electrodes of an LSI with a given wiring pattern on a circuit substrate, at least a portion of the electronic part is covered with a heat-shrinkable film member which in turn is fixedly mounted on the circuit substrate by adhesive at the opposite side or all the sides of the heat-shrinkable film member. When the heat-shrinkable film member is heated, the shrinkage of the heat-shrinkable film member presses the LSI against the circuit substrate under pressure. Thus, the bumps of the LSI can be electrically connected with the wiring pattern on the circuit substrate. Therefore, the LSI can be easily mounted on the circuit substrate or replaced by a new one.

Method of mounting electronic part on circuit substrate and circuit

Connection structure between a tab film and a liquid crystal panel

In the disclosed semiconductor device mounting arrangement, an integrated circuit has an elastic body on one surface and protruding electrodes on the opposite surface and a support frame includes a pressing member to engage the elastic body directly so as to force the protruding electrodes into engagement with a wiring pattern formed on a substrate. In the disclosed semiconductor device mounting method, a liquid crystal display panel having an integrated circuit with protruding electrodes is placed on a wiring pattern and an elastic body is provided on the surface of the integrated circuit which is opposite from the protruding electrodes. The assembled components are positioned between a pressing portion and a base member of a support frame so that the elastic body is compressed and the reaction from the compression is utilized to engage the protruding electrodes with the wiring pattern.

Mounting arrangement for a semiconductor device

In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.

Method of assembling an electronic part device

A display apparatus of plane type includes a display panel, a drive signal supplying board arranged opposite to the display panel at a predetermined space therefrom for supplying a drive signal for the display panel, a drive integrated circuit device mounted on the board through a flexible plate and connected to a connecting portion of the display panel through the flexible plate, a first polarizing plate arranged on the upper surface of the display panel, and a second polarizing plate arranged to the under surface of the display panel and extending to the under surface of the drive signal supplying board to be fixed thereto.

Growing community of inventors

Kyoto, Japan

Minoru Hirai