Tokyo Seimitsu Co., Ltd.

Minoru Ametani

Isamu Kawashima

Hideshi Sato

Hideo Kino

Masaki Kanazawa

Kazuo Kobayashi

Motoi Nezu

Daisuke Akita

A tape adhering device including: a drawing roller for drawing out a tape; a tape fixing means for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered under the condition that fixing operation of the tape by the tape fixing means is released.

Tape adhering method and tape adhering device

A film peeling device for peeling a film () adhered to a front surface of a wafer (), on the back surface of which a dicing tape () is adhered, the wafer is integrated with a mount frame () into one body, comprises: a movable table (), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means () for covering an adhesive face () of the dicing tape, which is exposed between the mount frame and the wafer at one end () of the wafer; and a adhering means () for adhering a peeling tape () to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end () of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Surface protection film peeling method and surface protection film peeling device

In a peeling tape attaching apparatus for attaching a peeling tape () on a surface protective film () attached on the surface of a wafer (), the wafer is supported on a movable table () with the surface protective film up and the peeling tape is supplied on the surface protective film of the wafer. The movable table is moved in such a manner that an end () of the wafer is located under a peeling tape attaching unit (), and pressure is exerted by pressing the peeling tape attaching unit against the surface protective film of the wafer via the peeling tape. After that, the movable table is moved toward the other end () of the wafer, and upon movement of the movable table, by a predetermined distance, from the peeling tape attaching unit, the pressure is canceled.

Apparatus for attaching a peeling tape

A film separation apparatus () for separating a film () attached to a film application surface of a wafer () comprises a wafer adsorption unit () for adsorbing the wafer with the film application surface up, a release tape supply unit () for supplying the release tape () onto the film application surface, and a heating unit () for pressing and heating only a part of the release tape against the wafer film at an edge of the wafer. Thus, the adhesion between the release tape and the film is increased at the particular part of the release tape. The apparatus further comprises a peeling unit () for separating the film from the film application surface of the wafer using a release tape with a part of the release tape having an improved adhesion as a separation starting point. Thus, the surface protective film can be easily separated from the wafer.

Film separation method and film separation apparatus

A wafer processing apparatus (), for processing a wafer () with a surface protective film () attached on the front surface () on which at least one circuit pattern is formed, includes a dicing tape application unit () for attaching a dicing tape () on a frame () and the wafer, a surplus dicing tape take-up unit () for taking up the surplus part of the dicing tape attached on the frame and the wafer and a surface protective film peeling unit () for peeling the surface protective film from the wafer using a peeling tape (). At least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit is slidably arranged in that order on common rails (). As a result, tape can be loaded and the maintenance work on each unit can be carried out easily.

Wafer processing apparatus

A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, the air bubbles existing between the semiconductor wafer and the surface protective film are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film is peeled from the semiconductor wafer. As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented.

Method and apparatus for peeling surface protective film

A dicing tape attaching apparatus () comprises a fixed table () for supporting a mount frame (), a movable table () for supporting a wafer () with the reverse surface thereof ground, and a height adjusting unit () such as a screw jack for adjusting the height of the movable table. When the dicing tape () is attached on the mount frame and the wafer, the height adjusting unit such as the screw jack so operates that the height of the dicing tape attaching surface of the wafer supported on the movable table coincides with the height of the upper surface of the mount frame supported on the fixed table. As a result, the wafer is prevented from forming cuts, cracks and internal distortions.

Dicing tape attaching apparatus and dicing tape attaching method

A workpiece processing device () for processing a workpiece () comprises: a surface protection film peeling means () for peeling a surface protection film (), which is adhered to a front surface () of a workpiece, with a peeling tape (); a bar code adhering means () for adhering a bar code () corresponding to the workpiece to the workpiece; and a movable support table () for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Workpiece processing device

A method and an apparatus for adhering a tape () on a wafer () are disclosed. The wafer is supported on a table (), and the tape is supplied, between a tape adhering surface (') and a tape adhering unit (), from a tape supply unit (). The table is moved toward the tape adhering unit, whereby the tape adhering surface of the wafer on the table is pressed against the tape adhering unit through the tape with a force (F). Further, the tape adhering unit is moved from one end () to the other end () of the wafer in parallel to the tape adhering surface. The pressure (P) under which the tape adhering surface is in contact with the tape adhering unit through the tape is kept substantially uniform while the tape adhering unit moves from one end to the other end of the wafer. As a result, the pressure on the wafer is accurately equalized in spite of the movement of the tape adhering unit.

Tape adhering method and tape adhering apparatus

A film peeling device for peeling a film which has been stuck onto a film sticking face of a wafer including: a wafer sucking means for sucking the wafer so that the film sticking face of the wafer can become an upper face; a peeling tape feeding means for feeding a peeling tape onto the film of the film sticking face; a pushing means for pushing only one portion of the peeling tape against the film at an edge portion of the wafer so that the adhesive strength between the peeling tape and the film can be enhanced in the one portion of the peeling tape; and a peeling means for peeling the film from the film sticking face of the wafer by the peeling tape while the one portion of the peeling tape, the adhesive strength of which has been enhanced, is used as a peeling start portion.

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Mitaka, Japan

Minoru Ametani